Sony xr ca 630 x service manual

Page 1

2 XR-CA630X Notes on chip component replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing -Keep the temperature of the soldering iron around 270 ˚C dur- ing repairing. -Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). -Be careful not to apply force on the conductor when soldering or unsoldering. TABLE OF CONTENTS 1. GENERAL Location of Controls ....................................................... 3 2. DISASSEMBLY 2-1. Disassembly Flow ........................................................... 8 2-2. Sub Panel Assy ................................................................ 8 2-3. Mechanism Deck (MG-25F-136) ................................... 9 2-4. MAIN Board ................................................................... 9 2-5. Heat Sink (2P) ................................................................. 10 3. ASSEMBLY OF MECHANISM DECK 3-1. Assembly Flow ................................................................ 11 3-2. Housing ........................................................................... 11 3-3. Arm (Suction) ................................................................. 12 3-4. Lever (LDG-A)/(LDG-B) ............................................... 12 3-5. Gear (LDG-FT) ............................................................... 13 3-6. Guide (C) ......................................................................... 13 3-7. Mounting Position of Capstan/Reel Motor (M901) ....... 14 4. MECHANICAL ADJUSTMENTS ....................... 15 5. ELECTRICAL ADJUSTMENTS Tape Deck Section .......................................................... 15 Tuner Section .................................................................. 15 6. DIAGRAMS 6-1. Note for Printed Wiring Boards and Schematic Diagrams ....................................................... 16 6-2. Printed Wiring Board – MAIN Board –......................... 17 6-3. Schematic Diagram – MAIN Board (1/3) –................... 18 6-4. Schematic Diagram – MAIN Board (2/3) –................... 19 6-5. Schematic Diagram – MAIN Board (3/3) –................... 20 6-6. Printed Wiring Board – SUB Board –............................ 21 6-7. Schematic Diagram – SUB Board –............................... 21 6-8. Printed Wiring Board – KEY Board –............................ 22 6-9. Schematic Diagram – KEY Board –.............................. 23 6-10. IC Pin Function Description ........................................... 26 7. EXPLODED VIEWS 7-1. Chassis Section ............................................................... 29 7-2. Front Panel Section ......................................................... 30 7-3. MAIN Board Section ...................................................... 31 7-4. Mechanism Deck Section (MG-25F-136) ...................... 32 8. ELECTRICAL PARTS LIST ............................... 33