Sony xmsd 46 x service manual

Page 1

XNI-SD46X

SERVICE MANUAL

Ver. 1.0 2004. 12

US Model
Canadian Model
AEP Model

UK Model
E Model

SPECIFICATIONS

AUDIO POWER SPECIFICATIONS (US MODEL)

POWER OUTPUT AND TOTAL HARMONIC DISTORTION
60 watts per Channel minimum continuous average power into

4 ohms: both channels driven from 20 Hz to 20 kHz with no more
thzm 0.08% total harmonic distortion per Car Audio Ad Hoc
Committee standards.

Other Specifications
circuit system OTL (output iransformerless) circuit
Pulse power supply

Inputs RCA pm jacks
High level mpttt connector
Outputs speaker terminals

Suitable speaker impedance

2 7 s 9 (stereo)

4 7 s 9 (when used as a bridging amplifier)
Four speakers;

120wX 4(at4o>

ISOWX 4(at 29)

Three speakers:

120w x2+300W>< 1 (at4S2)
Rated outputs (supply voltage at 144 V)

Four speakers;

on w RMS x 4 (20 Hz 7 20 kHz.
0.08% THD + N. at 4 9.)

75 w RMS x 4 (20 Hz 7 20 kHz.
01% THD + N. at 2 9)

Three speakers:

6[)WRMS >< 2+ 150w RMS x 1 (20
H2720 ltl-lz. 0.1% THD + N. at 4 52)
97 dBA (Reference 1w into 4 Q)

5 Hz 7 50 kHz (t: dB)

0.005% or less (at 1 kHz)

Maxrmum outputs

SN Ratio
Frequency response
Harmonic distortion

9-879-366-01 Sony Corporation
2004L04-1 e Vehicle Company
© 2004. 12 Published by Sony Engineering Corporation

lnpttt level adjustment range

0.3 7 6,0V (RCA pin jacks)

1.2 712V(Higltleteltnput)

50 r 300 Hz. 712 dB/oct

50 r 300 Hz. 712 dB/oct

0 710 dB (40 Hz)

12 v DC car battely

(negative ground)

10.5 r 16 V

at rated output: 31 A (4 9)
Remote input: 1 mA

Approx, 403 x 55 x 277 mm
(wlh/d) (15 7/x x 2 174 x 11 in) not
incl. projecting parts and controls
Mass Approx, 4.7 kg (10 lb. 6 oz.)1lnt1ncl.
accessories

Mounting screws (4)

High level input cord (1)
Protecilon cap (1)

Low boost
Power requirements

Power supply voltage
Current drain

Dimensions

Supplied accessories

Design lllIlI .Y]?lL'i_fiLllIll)ll.Y (ml Nib/ml 10 change wlllmul
notice,

STEREO POWER AMPLIFIER
S ONY;

Page 2

XM-SD46X

Notes on Chip Component Replacement

- Never reuse a disconnected chip component.

- Notice that the minus side of a tantalum capacitor may be
damaged by heat.

UNLEADED SOLDER

Boards requiring use of unleaded solder are printed with the lead

free mark (LF) indicating the solder contains no lead.

(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)

LEAD FREE MARK

Unleaded solder has the following characteristics.

- Unleaded solder melts at a temperature about 40 °C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solderjoint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the

heated tip is applied for too long, so be careful!

- Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur
such as on IC pins, etc.

' Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

SAFETY-RELATED COMPONENT WARNING !!

COMPONENTS IDENTIFIED BY MARK A OR DOTTED LINE
WITH MARK A ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.

ATTENTION Au COMPOSANT AYANT RAPPORT
A LA sEcunmau

LES COMPOSANTS IDENTIFIES PAR UNE MARQUE A SUR LES
DIAGRAMMES SCHEMATIOUES ET LA LISTE DES PIECES
SONT CRITIQUES POUR LASECURITE DE FONCTIONNEMENT.
NE REMPLACER CES COMPOSANTS QUE PAR DES PIECES
SONY DONT LES NUMEROS SONT DONNES DANS CE MANUEL
0U DANS LES SUPPLEMENTS PUBLIES PAR SONY.

2

TABLE OF CONTENTS

1 . G EN ERAL
Location and Function of Controls
Connections ..............................

2. DISASSEMBLY

2- 1. Bottom Plate ......... 6
272. Main Board Section 7
273. Main Board, Input Level Board 7
2-4. LED Board ............................... S
3. ELECTRICAL ADJUSTMENT ...................................... 9

4. DIAGRAMS

471. Block Diagram ..... .......
472. Printed Wiring Board iMain Sectioni
4-3. Schematic Diagram iMain Section (1/2}
4-4. Schematic Diagram iMain Section (2/2)7 ......
475. Printed Wiring Boards ilnput Level, LED Section

5. EXPLODED VIEWS
51. Heat Sink (Main) Section
5-2. Main Board Section .......

.16
.17

6. ELECTRICAL PARTS LIST ........................................ 18