Sony xm 7557 service manual

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nil-75577

SERVICE MANUAL

US Model
Canadian Model
AEP Model

UK Model
E Model

SPECIFICATIONS

POWER OUTPUT AND TOTAL HARMONIC DISTORTION

75watts/ 220watts per channel minimum continuous average power into 4ohms,
Scharmels driven from 20Hz to 20kHz with no more than 0.04%* total harmonic
distortion per Car Audio Ad Hoc Committee Standards.

Other Specifications

Circuit system Pure Direct Drive SEPP
Pulse power supply

lnpnts RCA pin jacks

Outputs Speaker terminals

Speaker impedance 2 » s Q (F/Rch), 1 fl - 8 o (Suhwoofer)
4 V 8 {I (when used as a bridging
amplifier, F/Rclr)
Maximum outputs (Front/Rear t Subwouler)
150 watts x 4 + 500 watts x1(at4 o)
360 wattsx 2 + 500 watts x1(at4 n)
Rated outputs (Supply voltage at 14.4 v*, 20 Hz » 20 kHz)
From/Rear: 75 watts x 40104 % THD, at 4 Q)
90 watts x 4 (0.1 % THD, at 2 o)
180 watts x 2 (III "la THD, at4 Q)
Subwooler: Hisvoltage 220 watts (0.04 "l: THD, at m)
Iii-voltage 280 watts (0.1 % THD, at 2 £2)
Iii-current 280 Watts (01 % 'I'HD, at l [2)
Frequency response 5 H7. - 100 kHz ( :2 dB)
Harmonic distortion 0.005 % or less (at 1kHz,4 0")
Input level adjustment range.
0.2 ~ 4.0 V
High-pass filter (x l/x lo) 50 - 41X) Hz/SOO Hz - 4 kHz, '12 dB/oct
Low-pass filter(x Hit 10) 50 - 400 llz/SOO Hz « 4 kHz, -12 dB/uct
50 - 200 Hz, *12 dB/oct (Subwooler)

I.-
MICROFILM

Low boost 0 - 10 dB (40 Hz) (Front/ Rea r)
Low boost and cut 0 - 10 dB (7 , 40 Hz) (Subwoofer)
Power requirements 12 V DC car battery

(negative fround)
Power sugply voltage 10.5 - 16
Current rain at rated output: 81 A

(4D til-VOLTAGE mode)
Remote in ut: 1.5 mA

Dimensions Approx. 6§7 x 83.5 x 260 (303 with cover)
mm
(w/lr/d) (25 Va x 3 3/3 x 10 1/4 in.) not
incl. projecting parts and controls

Mass Approx. 9.5 kg (20 lb. 15 oz.) not ind.
accessories

Supplied accessories Mounting screws (fl)
Terminal cover (1)

Hexagonal wrench 3 mm (1/8 in) (1)

NFB ON
ill-CURRENT only

Design and specifications are subject to change without notice.

STEREO POWER AM PLIFER

SONY;
J

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TABLE OF CONTENTS Notes on chip component replacement
- Never reuse a disconnected chip component.
1_ SERVICE MODE _____________________________________________________________ 3 . Notice that the minus side of a tantalum capacitor may be
damaged by heat.
2. GENERAL .......................................................................... 4
3. DISASSEMBLY

3-1. Side Plate, Sub l/Sub 2 and Filer Board
372. Amplifier/Power Board and LED Board

4. ELECTRICAL ADJUSTMENT .................................... 7

5. DIAG RAMS

571. Block Diagram 7 Amplifier Section 7
5-2. Block Diagram 7 Power Section 7..
5-3. Block Diagram 7 Sub l/Sub 2 Section 7
574. [C Block Diagrams ............................
575. Printed Wiring Board 7Filter/Sub 1/Sub 2 Section 7
576. Printed Wiring Board 7Amp1ifier Section 7 ............
577. Schematic Diagram

7Amplifier(1/3)/Filter/Sub 1/Sub 2 Section 7 ..................... 13
578. Schematic Diagram/Printed Wiring Board

7Amplifier (2/3)/LED/TR Section 7 ................................... 14
5-9. Printed Wiring Board 7Power Section 7 ............................. 15
5-10. Schematic Diagram

7Power/Amp1ifier (3/3)/TR/LED Section 7. . 17
6. EXPLODED VIEWS
6-1. Plate and Cover Section . 18

672. Board and Heat Sink ..... . 18

7. ELECTRICAL PARTS LIST ........................................ l9