Sony xm 2150gsx car amplifier
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Page 1
XNI-Z15IIGSX
SERVICE MANUAL us Model
Ver 1.0 2001_ 12 Canadian Model
SPECIFICATIONS
AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND TOTAL HARMONIC DISTORTION
150 watts per channel minimum continuous average power into
4 ohms. both Channels driven from 20 Hz to 20 kHz with no more
than 0.04% tmal harmonic distonion per Car Audio Ad Hoc
Committee standards.
Other Specifications
circuit system OTL (output transformerless) circuit High7pass filter 50 7 300 Hz. 712 dB/oct
l>ulse power supply Low7pass filter 507 300 Hz, 712 dB/oct
lnputs RCA pin jacks Low boost 0 7 10 dB (40 Hz)
High level input connector Power supply voltage 10.5 7 16 V
Outputs Speaker terminals Current dram at rated output : 40 A (at 4 0)
Through ottt pin jacks Remote inpttt : 2 mA
speaker impedance 2 7 x 0 (stereo) Dimensions Approx. 14 to X 2 1/4 X 10 II: in,
4 7 x 0 (when used as a bridging amplitier) (358 x 50 x 264 mm)
Maxrmum outputs 300 W X 2 (at 4 n) (w/h/d) not incl. projecting parts and controls
760 w (mouaural) at 4 a Mass Approx. 3.5 kg (7 lb. ll oz) not incl, accessories
Rated outputs (supply voltage at 144 V) Supplied accessories Mounting screws (4)
150 W X z (20 Hz 7 20 kHz, 004% THDs
at 4 9) Design and ,i-pt»t-tfittttitm,r (Irz' sub/m It; Lhtmgt: wit/mm
190 W X 2 (20 Hz 7 20 kHz, 01% THD, Home.
at 2 o)
380 w (monaural) (20 Hz 7 20 kHz. 0.1% THD,
at 4 9)
Frequency response 5 Hz 7 100 kHz (Aida)
l-larmonic distortion 0.005% or less (at 1 kHz. 4 9)
input level adjuslment range
0.2 7 6.0 v (RCA pm jacks)
0.47 12,0V (High level input)
STEREO POWER AMPLIFIER
9-873-436-01 Sony Corporation S O N Y
2001 L0400-1 e Vehicle Company
© 2001.12 Published by Sony Engineering Corporation ®
Page 2
XM-215OGSX
Note for Replacement of FET
Change the both channels of FETs at the output stage.
If one or both parts in the following combination is broken, the
service kit should be ordered.
Service kit part No.
0108, 112
0208 212 XA33817586»1
0109, 113
0209 213 X-3381A587-1
Notes on Chip Component Replacement
0 Never reuse a disconnected chip component.
I Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY MARK A OR DOTTED LINE
WITH MARK A ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
A LA SECURITE!!
LES COMPOSANTS IDENTIFIES PAR UNE MARQUE A SUR LES
DIAGRAMMES SCHEMATIOUES ET LA LISTE DES PIECES
SONT CRITIQUES POUR LASECURITE DE FONCTIONNEMENT.
NE REMPLACER CES COMPOSANTS QUE PAR DES PIECES
SONY DONT LES NUMEROS SONT DONNES DANS CE MANUEL
OU DANS LES SUPPLEMENTS PUBLIES PAR SONY.
2
TABLE OF CONTENTS
1 . G EN ERAL
Location and Function of Controls
Connections ..............................
2. DISASSEMBLY
2.1_ Bottom Plate .. 6
272. Main Board 6
273. Front Panel . 7
2-4. Led Board 7
3. ELECTRICAL ADJUSTMENT ...................................... 8
4. DIAGRAMS
4-1. Block Diagram .....
4.2 Schematic Diagram iMain Section (1/2)7
473. Schematic Diagram iMain Section (2/2)7
4-4. Printed Wiring Boards iMain Sectioni
5. EXPLODED VIEWS
51. Heat Sink Section
5-2. Main Board Section
.14
.15
6. ELECTRICAL PARTS LIST ........................................ l6