Sony xdr s 1 service manual
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Extracted text from sony xdr s 1 service manual (Ocr-read)
Page 1
2 XDR-S1 SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE P ART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. Flexible Circuit Board Repairing -K eep the temperature of the soldering iron around 270˚C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. Notes on Chip Component Replacement -N ever reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. - UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40°C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350°C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. TABLE OF CONTENTS 1. GENERAL 2. DISASSEMBLY 2-1. Cabinet (Rear) Assy ............................................................ 4 2-2. Wires ........................................................................\ ........... 5 2-3. Cabinet Upper Assy ............................................................ 5 2-4. Key Board ........................................................................\ ... 6 2-5. Tuner Board ........................................................................\ . 6 2-6. Micon Board ....................................................................... 7 2-7. Power Board, Jack Board .................................................... 7 3. ELECTRICAL ADJUSTMENTS ................................... 8 4. DIAGRAMS 4-1. Printed Wiring Board –Tuner Section– ............................. 10 4-2. Printed Wiring Boards –Micon Section– .......................... 11 4-3. Schematic Diagram –Tuner, Micon Section– ................... 12 4-4. Printed Wiring Boards –Audio, Power Supply Section– .. 13 4-5. Schematic Diagram –Audio, Power Supply Section– ....... 14 5. EXPLODED VIEWS 5-1. Cabinet (Rear) Section ...................................................... 17 5-2. Cabinet Front Section ........................................................ 18 5-3. Chassis Section ................................................................. 19 6. ELECTRICAL PARTS LIST ........................................ 20
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3 XDR-S1 SECTION 1 GENERAL This section is extracted from instruction manual. - LOCATION OF CONTROLS