Sony xa cc 1 service manual

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2 XA-CC1 1. GENERAL ................................................................... 3 2. DIAGRAMS ................................................................. 4 2-1. Note for Printed Wiring Boards and Schematic Diagram ......................................................... 4 2-2. Schematic Diagram ......................................................... 5 2-3. Printed Wiring Board – BUS Board (Component Side) – ................................. 6 2-4. Printed Wiring Board – BUS Board (Conductor Side) – ................................... 7 2-5. IC Pin Function Description........................................... 8 3. EXPLODED VIEW ................................................... 9 4. ELECTRICAL PARTS LIST ............................... 10 TABLE OF CONTENTS Notes on chip component replacement -N ever reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40 ˚C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 ˚C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscou-s (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges oc- cur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.