Sony wm dd 3 service manual

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sony wm dd 3 service manual

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Page 1

Refer t MDR-15L Service Manual Issued prevtously
SERVICE MANUAL for informati n of headphones supplied with this set.

HEADPHONES jacks (stereo mlnljacks) A EP Made/


VOLUME control
FlEW » (rewind) button
BATTERY indicator

« FF (fast tomardl button
DOLBY NR switch

4 PLAY button

I STOP button TAPE selector

Dolby noise reduction manufactured under license from

Dolby Laboratories Licensing Corporation. PHOTO: BLACK TYPE
"DOLBY" and the double-D symbol D0 are trademarks of

Dolby Laboratories Licensing Corporation.

SPECIFICATIONS Similar Mechanism Set WM-DD
Tape track Tape Transport Mechanism Type DDA100
Hrack 2-channel stereo
Fast winding time
Approx. 2 min. with Sony Cassette 060 Dimensions
Frequency response Approx. 79.7 X110 x 32.8 mm (wlhld)
40-15000 Hz (3/.><4/.>< 15/ inches)
Wow and flutter incl. projecting parts and controls
10.13% (DIN) Weight
0.08% WRMS (NAB) Approx. 2909 (10.301) incl. batteries,
Power output not incl. other accessories
Headphones:
20 rnW + 20 mw (at 10% harmonic distortion) Note: ll a car battery cord or an AC power adaptor not manufactured by Sony
load impedance 32¢,th Is used, a fuse must be installed in the battery cord or the AC power
at DC operation adaptor and the polarity oi the plug must be as illustrated.
Outputs
Two HEADPHONES jacks (stereo minijacks) ,
load impedance 8-300 ohms I
Power requirements
av 00. two R6 (size AA) batteries
DO IN 3V jack accepts:
EBP5OO battery case (optional) for use on
two R20 (size Di batteries FEATURES
AC-DZM AC power adaptor (optional) lor use
0 220V AC. 50 H1 . _ 2v 0 Disc Drive system assures accurate and stable tape trans
EgizgectrLDCC-QM car battery cord (optional) for use With 1 port, greatly reducing WOW and flutter.
(For connection With the DOC-127A, the optional P0200 DC plug ' DOIby NR Syswm reduces tape hiss Gise
adaptor is required.) - Tape selector tor optimum playback with standard tapes
BalleY '6 as well as high-performance tapes.
Batteries Continuous playback hours 0 Two HEADPHONES jacks allow two persons to listen to
Sony batteries SUM~3 (NS) Approx. A tape playbaCk Ogemer'
Sony alkaline batteries AM3 Approx. 9 J

For maximum pericrmance we recommend the use oi alkaline
batteries.

STEREO CASSETTE PLAYER
SONZ

Page 2

WM-DDlll

Replacing chip components

All chip components should be connected and disconnect-
ed, using a tapered soldering iron [temperature of the iron
tip: less than 280°C (536°F)] , a pair of tweezers and braid-
ed wire.

Precautions for replacement

1. Do not disconnect the chip component forcefully.
Otherwise, the pattern my peel off.

2. Never re-use a disconnected chip component. Dispose of
all old chip components.

3. To protect the chip component, heating time for attach-
ing the component should be within 3 seconds.

0 Removing chip components
(I) Removing solder at electrode
Remove the solder at the electrode, using a thin
braided wire. Do not remove the solder of the part
(chip component) attached adjacent to the electrode.

Pattern Soldering iron

Braided wire

(2) Disconnecting chip components
Turn the tweezers with the soldering iron alternately
applied to both electrodes, and the chip component
will be disconnected. Take careful precautions while
disconnecting, because if the chip component is force-
fully removed the land may peel off.
Never re-use a disconnected chip component.

Tweezers
Turn jg !§

(3) Smoothing the soldered surface
After disconnecting the chip component, remove the
solder by using a braided wire to smooth the land
surface.

0 Connecting chip components
The value of chip components is not displayed on the
main body. Take due precautions to avoid mixing new
chip components with other ones,

(1) Applying solder to land on one side
Apply a thin layer of solder to the land on one side
where the chip component is to be connected. Too
much solder may cause bridging.

Small quantity of solder

i?

(2) Speedy soldering
Hold the chip component at the desired position,
using tweezers, and apply the soldering iron in the
arrow-marked direction. To protect the chip compo-
nent, heating time should be within 3 seconds.

Soldering iron 6]

A L

le-t-j

Land Printed circuit board

(3) Speedy soldering of electrode on the other side
Solder the electrode on the other side in the same
way as in (2) above.