Sony tc k 750 es service manual

Page 1

SERVICE MANUAL

AEP Model

Dolby noise reduction manufactured under license from
Dolby Laboratories Licensing Corporation.
"DOLBY" and the double-D symbol D0 are trademarks of
Dolby Laboratories Licensing Corporation.

Recording system
BIas
Heads

Motors

Wow and flutter

TC - K950ES
TCM - 200D3

Model Name Using Similar Mechanism

Tape Transport Mechanism Type

SPECIFICATIONS

Mrack z-channel stereo

bias
Erase head x1 (S 8r F head)
Recording head x1 (Permalloy head)
Playback head x1 (Permalloy head)
Capstan motor x1
(direct drlve Ilnear torque BSL motor)
Heel motorx1 (DC motor)
10.07% W Peak (DIN)

Fast-forward and rewind time

Approx. 90 sec. (wlth 060 cassette)

Frequency response (DOLBY NR OFF)

Outputs

Llne outputs
(phono Jacks)

Rated output level 0.44 V (-5 dB) at a
load impedance
47k ohms

Load Impedance

Over 10k ohms

Headphones
(stereo phone lack)

Output level

0-25 mW at a load
impedance of 32

TYPE IV cassette
(Sony METAL-ES)

20-21.000 Hz (:3 dB, DIN)
20-16,000 Hz (OVU recording)

TYPE II cassette

20-19,000 Hz (:3 dB, DIN)

(Sony UX-S)
TYPE I cassette 20-17.000 Hz (13 dB, DIN)
(Sony HRS)
Signal-tonolse ratio (at peak level)
Dolby NR switch OFF B-TYPE O-TYPE
Cassette ON ON
TYPE IV (Sony METAL-ES) 60 dB 69 dB 75 dB

TYPE n (Sony we

59 dB 68 dB 74 dB

TYPE I (Sony HF-S)

57 d8 66 dB 72 dB

Inputs

Total harmonlc dlstortlon

1.0% (with Sony METALES cassette)

Line inputs

Sensitivity 77.5 mV (-20 dB)

(phone jacks)

Input Impedance 50k ohms

ohms

General

Power

requlrements 220 or 240 V AC adiustable, 50/60 Hz
Power consumption 23 W

Dimensions Approx. 430 x 135 x 350 mm (w/h/d)
(17 x 5/.x13/. inches)
Weight Approx. 6.9 kg (15 lbs 4 02)

Su lled accessory Audio connectlng cord (2)
Opt onal accessory ereless remote control unlt RM-J701

Deslgn and specltlcatlons subject to change without notlce.
Note

This appllance conforms with EEC Directlve 87/308IEEC
regardlng interference suppresslon.

STEREO CASSETTE DECK

SONY;

Page 2

TC- K75OES I

TABLE OF CONTENTS

Section E BEES Flexible Circuit Board Repairing
~ Keep the temperature of the soldering iron around
270°C during repairing.
Do not touch the soldering iron on the same conductor
of the circuit board (within 3 times).
1. GENERAL ......................................... 3 . Be careful not to apply force on the conductor when
soldering or unsoldering.

SPECIFICATIONS .................................... 1

2. DISASSEMBLY .................................... 4 .
Notes on chip component replacement
- Never reuse a disconnected chip component.
3. ADJUSTMENTS ~ Notice that the minus side of a tantalum capacitor may
3-1. Mechanical Adjustments ................... 6 be damaged by heat.
8-2. Electrical Adjustments --------------------- 9
4. DIAGRAMs Dolby noise reduction and HX Pro headroom extension
4_1 Semiconductor Lead La outs .............. 14 manufactured under license from Dolby Laboratories
y Licensing Corporation. HX Pro originated by Bang &
4-2. Circuit Boards Location ~~~~~~~~~~~~~~~~~~~ 14 Olufsen.
4-3. Block Diagram ............................. 15
4.4 [c Block Diagrams ......................... 18
4-5. Printed Wiring Boards
-Main Section- .......................... 20
4-6. Schematic Diagram
.. Main Section .. .......................... 25
4~7. Printed Wiring Boards
_ Panel Section _ .......................... 30

4-8. Schematic Diagram
- Panel section _ .......................... 33

5. EXPLODED VIEWS

5-1 Overall Section ............................. 35
5-2. Panel Section .............................. 36
5-3. Mechanism Section (1)
(TCM- 200133) ............................... 37
5-4. Mechanism Section (2)
(TCM-200D3) ............................... 38
s. ELECTRICAL PARTS 51' ....................... 39

SAFETY-RELATED COMPONENT WARNING! I

COMPONENTS IDENTIFIED BY MARK A OR DOTTED
LINE WITH MARK A ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL T0 SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB<
LISHED BY SONY.