Sony ta sb 500 wr service manual

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sony ta sb 500 wr service manual

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Page 1

TA-SBSUDWR

SERVICE MANUAL AEP Model

UK Model
E Model
Australian Model

Ver 1.0 2004.06

TA-SBSOOWR is the amplifier section in DAV-SBSOOW.

SPECIFICATIONS

Amplifier section

Sunouml mode (reference)
Surround: 96 W+96 W
(with SSrTS l l)

* Depending on me .rmmd field senmgx and we were

there may be no .wund mupm.

General
Power rcquircmcms 220 , 240 V AC, 50/60 Hz
Power consumption 36 W (2207240 V AC)

Dimensions (approx) 65 X 95 X 344 mm
(w/h/d) incl. speaker cord
cover

Mass (approx) 1.3 kg

Design and specificaliuns an: subject [0 change
without noiicc.

9-879-016-01 30W Corporation
2004F0571 Home Audio Company
©2004.06 Published by Sony Engineering Corporation ®

Page 2

TA-SB500WR

Notes on chip component repIacement
- Never reuse a disconnected chip component.
0 Notice that the minus side of a tantalum capacitor may be
damaged by heat.

UNLEADED SOLDER

Boards requiring use of unleaded solder are primed with the lead-

free mark (LF) indicating the solder contains no lead.

(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)

. : LEAD FREE MARK
Unleaded solder has the following characteristics.
- Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solderjoint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
- Strong viscosity
Unleaded solder is more viscou~s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
- Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

SAFETY-RELATED COMPONENT WARNING !!

COMPONENTS IDENTIFIED BY MARK A OR DOTTED LINE
WITH MARK A ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL T0 SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.

2

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271.
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273i
274.
275.
276.

3.

371.
372.
373
3-4.
375.

376.

377.
378.

4.

471.
472.

5.

TABLE OF CONTENTS

GENERAL

DISASSEMBLY
Disassembly Flow
Wire Cover ......
Top Panel .............................
Side Panel, Front Panel Section
DIAT POWER Board
DIAT AMP Board

mamm4>4>

DIAGRAMS

Block Diagram ...............................................
Schematic Diagram 7 DIAT AMP Board (1/3)
Schematic Diagram 7 DIAT AMP Board (2/3) 7 .
Schematic Diagram 7 DIAT AMP Board (3/3) 7 ........... 11
Printed Wiring Board

7 DIAT AMP Board (Component Side) 7 ....................... 12
Printed Wiring Board

7 DIAT AMP Board (Conductor Side) 7 ..................
Printed Wiring Boards 7 POWER SUPPLY Section 7
Schematic Diagram 7 POWER SUPPLY Section 7 ....... 15

EXPLODED VIEWS

Panel Section ...........................
DIAT AMP/DIAT POWER Boar

20
21

Section

ELECTRICAL PARTS LIST ................................ 22