Sony st sdb 900 service manual
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Extracted text from sony st sdb 900 service manual (Ocr-read)
Page 1
ST-SDB900 2 Unleaded solder Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. -Unleaded solder melts at a temperature about 40°C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350°C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! TABLE OF CONTENTS 1. GENERAL ................................................................... 3 2. TEST MODE ............................................................... 4 3. DIAGRAMS 3-1. Block Diagram ................................................................ 9 3-2. Printed Wiring Board – MAIN Board (Side A) – ............ 10 3-3. Printed Wiring Board – MAIN Board (Side B) – ............ 11 3-4. Schematic Diagram – MAIN Board (1/3) – .................... 12 3-5. Schematic Diagram – MAIN Board (2/3) – .................... 13 3-6. Schematic Diagram – MAIN Board (3/3) – .................... 14 3-7. Printed Wiring Board – TRANS, AC SW, JOG, RM Board – ............................ 15 3-8. Printed Wiring Board – DISPLAY Board – .................... 16 3-9. Schematic Diagram – DISPLAY Board – ....................... 17 4. EXPLODED VIEWS 4-1. Case, Front Panel Section ................................................ 20 4-2. Chassis Section ................................................................ 21 5. ELECTRICAL PARTS LIST .................................. 22 SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUM- BERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLE- MENTS PUBLISHED BY SONY. -Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. -Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. Notes on chip component replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be dam- aged by heat. DAB frequency table Band-III (174 to 240 MHz) Frequency Label Frequency Label 174.928MHz 5A 209.936MHz 10A 176.640MHz 5B 211.648MHz 10B 178.352MHz 5C 213.360MHz 10C 180.064MHz 5D 215.072MHz 10D 181.936MHz 6A 216.928MHz 11A 183.648MHz 6B 218.640MHz 11B 185.360MHz 6C 220.352MHz 11C 187.072MHz 6D 222.064MHz 11D 188.928MHz 7A 223.936MHz 12A 190.640MHz 7B 225.648MHz 12B 192.352MHz 7C 227.360MHz 12C 194.064MHz 7D 229.072MHz 12D 195.936MHz 8A 230.784MHz 13A 197.648MHz 8B 232.496MHz 13B 199.360MHz 8C 234.208MHz 13C 201.072MHz 8D 235.776MHz 13D 202.928MHz 9A 237.488MHz 13E 204.640MHz 9B 239.200MHz 13F 206.352MHz 9C 208.064MHz 9D * This tuner does not support L-Band reception.
Page 2
ST-SDB900 3 SECTION 1 GENERAL This section is extracted from instruction manual. Main unit 1 (remote sensor) 2 POWE R switch 3 BAND 4 Display window 5 MENU 6 TUNING/SELECT 7 ENTER 8 MEMORY 9 DISPLAY q; TUNING MODE List of but ton l oca t ions and ref erence pages 2 8 96 5 34 7 1 q;