Sony srs z 30 service manual
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Extracted text from sony srs z 30 service manual (Ocr-read)
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2 Specifications ............................................................................ 1 1. GENERAL Locating the Controls ......................................................... 2 2. DIAGRAMS 2-1. Schematic Diagram ..................................................... 3 2-2. Printed Wiring Boards (1/2) ....................................... 4 2-3. Printed Wiring Boards (2/2) ....................................... 5 3. EXPLODED VIEWS 3-1. Main Section ............................................................... 7 4. ELECTRICAL PARTS LIST ..................................... 8 SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. Notes on chip component replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be dam- aged by heat. TABLE OF CONTENTS CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. SRS-Z30 z UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead-free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. -Unleaded solder melts at a temperature about 40°C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350°C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! -Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. -Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ! LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPÉMENTS PUBLIÉS PAR SONY. SECTION 1 GENERAL Left speaker (front) Right speaker (front) POWER VOLUME PHONES This section is extracted from instruction manual. LOCATING THE CONTROLS
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33 SRS-Z30 SECTION 2 DIAGRAMS 2-1. SCHEMATIC DIAGRAM - Refer to page 6 for Notes. R31 D3 C6 C4R2 C13 C15R11 R39 C55 C106 R7 R10 C19C20 C27 R35 R33R32 R14 R17 R20 R15 C22 C25RV1(2/2) C28 C108 C37 R24 C41 C44 C46 R30 C50 C49 R29 C48 C42 C38 C34 IC2 IC3 R4 R1 R3 R5 C14C16 C105 R9R38 R12 C54C24 R16 R21 RV1(1/2) R19 C26 C29 C107R23 C35 C39 C43 C45 C52D4 C53 C51 R28 R27 R26 R25 R34 C30 D1 R18 R22 C23 C32C36C40 C47 JK2JK3 CL4 CL5 P1 CL1CL2 CL3 SP1 JK4 JK1 S1 C8 C9 C10 IC1 Q1 Q2 R40 LED LT0323-41-URF4 10 16V 10 16V 3.3k 0.047 0.047 12k 470 1 50V 100p 2.7k 180k 0.147 16V 10 16V 180k 10k10k 91 220 3.3k 4.7k 4700 0.15K 1 50V 100p 100 4V 91 100 16V 1 0.1 91 100 4V 100 4V 91 1 100 16V 100 4V 100 16V TEA2025D POWER AMP (L-CH) TEA2025D POWER AMP (R-CH) 3.3k 3.3k 3.3k 2.7k 0.0470.047 100p 180k470 12k 1 50V 4700 4.7k 3.3k 5K 220 0.1 1 50V 100p91 100 4V 100 16V 1 0.1 1000 6.3V UDZ6.8B 1000 16V 0.1 470 470 1k 1k 1k 10 16V 1SS226 10k 10k 47 4V 100 16V 100 4V 100 16V 1 (INPUT1) 10 16V BP10 16V BP10 16V BP LM358D PRE AMP DTC144TKA MEGA BASS DTC144TKA MEGA BASS 91 180 VOLUME VOLUME SPEAKER - S1 -2 -1 OFF ON EXCEPT JEW C53 C51 JK4 R37 2.2k R36 8.2k S1 Q3 2SB1436 B+ SWITCH 1000 16V 0.1 - S1 -2-1 OFF ON JEW 9.2 9.2 8.6 V er 1.2