Sony SCD C555ES Service Manual
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2 SCD-C555ES SAFETY-RELATED COMPONENT WARNING !! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ!! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY. SAFETY CHECK-OUT After correcting the original service problem, perform the following safety checks before releasing the set to the customer: Check the antenna terminals, metal trim, metallized knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below. LEAKAGE The AC leakage from any exposed metal part to earth Ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microampers). Leakage current can be measured by any one of three methods. 1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers instructions to use these instruments. 2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job. 3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The limit indication is 0.75 V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2V AC range are suitable. (See Fig. A) Fig. A. Using an AC voltmeter to check AC leakage. 0.15µF To Exposed Metal Parts on Set 1.5kΩ AC voltmeter (0.75V) Earth Ground TABLE OF CONTENTS 1. SERVICING NOTES (1) ............................................. 3 2. GENERAL ........................................................................\ .. 4 3. DISASSEMBLY 3-1. Case··················\ ··················\ ··················\ ··················\ ······· 6 3-2. Front Panel Section ··················\ ··················\ ··················\ · 6 3-3. Main Board ··················\ ··················\ ··················\ ·············· 7 3-4. Audio Board ··················\ ··················\ ··················\ ············ 7 3-5. D-Power, I/O Board ··················\ ··················\ ··················\ · 8 3-6. CD Mechanism Deck (CDM59-DVBU5) ··················\ ···8 3-7. Optical Pick-Up Block (KHM-230AAA/J1NP) ············9 3-8. Table Assy ··················\ ··················\ ··················\ ··············· 9 3-9. Tray, Sensor Board ··················\ ··················\ ··················\ 10 3-10. Loading Motor Board ··················\ ··················\ ·············· 10 3-11. Adjusting Phase of Swing Gear and Gear (U/D) ········11 4. DIAGRAMS 4-1. Block Diagrams ··················\ ··················\ ··················\ ····· 13 - RF/Servo Section ··················\ ··················\ ··················\ 13 - Main Section-1 ··················\ ··················\ ··················\ ···· 14 - Main Section-2 ··················\ ··················\ ··················\ ···· 15 - Audio Section ··················\ ··················\ ··················\ ······ 16 - Display/Power Section ··················\ ··················\ ·········· 17 4-2. Schematic Diagram RF Section ··················\ ·············18 4-3. Printed Wiring Board RF Section ··················\ ············19 4-4. Printed Wiring Board Main Section (Side A) ···········20 4-5. Printed Wiring Board Main Section (Side B) ···········21 4-6. Schematic Diagram Main Section (1/5) ··················\ ·22 4-7. Schematic Diagram Main Section (2/5) ··················\ ·23 4-8. Schematic Diagram Main Section (3/5) ··················\ ·24 4-9. Schematic Diagram Main Section (4/5) ··················\ ·25 4-10. Schematic Diagram Main Section (5/5) ··················\ ·26 4-11. Schematic Diagram Audio Section (1/2) ·················27 4-12. Schematic Diagram Audio Section (2/2) ·················28 4-13. Schematic Diagram D-Power Section ··················\ ···29 4-14. Printed Wiring Board Audio Section ··················\ ······30 4-15. Printed Wiring Board In Out/D-Power Section ······31 4-16. Schematic Diagram In Out Section ··················\ ·······31 4-17. Schematic Diagram Display Section ··················\ ·····32 4-18. Printed Wiring Board Display Section ··················\ ··33 4-19. Schematic Diagram HP Section ··················\ ············34 4-20. Printed Wiring Board HP Section ··················\ ·········35 4-21. Schematic Diagram Sensor Section ··················\ ······36 4-22. Printed Wiring Board Sensor Section ··················\ ···37 4-23. Schematic Diagram Power Section ··················\ ·······38 4-24. Printed Wiring Board Power Section ··················\ ·····39 4-25. IC Block Diagrams ··················\ ··················\ ················· 40 4-26. IC Pin Function Description ··················\ ··················\ ···44 5. SERVICING NOTES (2) ................................................ 57 6. TEST MODE ...................................................................... 58 7. EXPLODED VIEWS 7-1.Case Section··················\ ··················\ ··················\ ············· 74 7-2.Front Panel Section ··················\ ··················\ ··················\ ·· 75 7-3.Main Chassis Section ··················\ ··················\ ················· 76 7-4.CD Mechanism (CDM59-DVBU5) -1 Section ··············77 7-5.CD Mechanism (CDM59-DVBU5) -2 Section ··············78 8. ELECTRICAL PARTS LIST ........................................ 79
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3 SCD-C555ES CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. LASER DIODE AND FOCUS SEARCH OPERATION CHECK Carry out the S curve check in CD section adjustment and check that the S curve waveform is output three times. Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing - Keep the temperature of soldering iron around 270 ˚C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. SECTION 1 SERVICING NOTES (1) NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repain parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. The emission check enables continuous checking of the S curve. When the bottom plate is removed, the RF board can be checked. eleven screws (BVTP3 × 8) RF board bottom plate