Sony scd 555 es service manual
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2 SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY. Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270 ˚C dur- ing repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. TABLE OF CONTENTS 1. SERVICING NOTES (1) ........................................ 3 2. GENERAL ................................................................... 6 3. DISASSEMBLY ......................................................... 9 4. DIAGRAMS 4-1. Notes for Printed Wiring Boards and Schematic Diagrams ....................................................... 15 4-2. Printed Wiring Boards – RF/SWITCH/LOADING MOTOR Boards – .............. 16 4-3. Schematic Diagram – RF/SWITCH/LOADING MOTOR Boards – .............. 17 4-4. Printed Wiring Board – MAIN Board (Component Side) – .............................. 18 4-5. Printed Wiring Board – MAIN Board (Conductor Side) – ................................ 19 4-6. Schematic Diagram – MAIN Board (1/6) – .................. 20 4-7. Schematic Diagram – MAIN Board (2/6) – .................. 21 4-8. Schematic Diagram – MAIN Board (3/6) – .................. 22 4-9. Schematic Diagram – MAIN Board (4/6) – .................. 23 4-10. Schematic Diagram – MAIN Board (5/6) – .................. 24 4-11. Schematic Diagram – MAIN Board (6/6) – .................. 25 4-12. Printed Wiring Board – AUDIO Board (Component Side) – ............................ 26 4-13. Printed Wiring Boards – AUDIO (Conductor Side)/ LINE OUT/HEADPHONE Boards – ............................. 27 4-14. Schematic Diagram – AUDIO Board (1/2) – ................ 28 4-15. Schematic Diagram – AUDIO (2/2)/LINE OUT/ HEADPHONE Boards – ................................................. 29 4-16. Printed Wiring Board – DIGITAL OUT Board – .......... 30 4-17. Schematic Diagram – DIGITAL OUT Board – ............ 31 4-18. Printed Wiring Board – DISPLAY Board – .................. 32 4-19. Schematic Diagram – DISPLAY Board – ..................... 33 4-20. Printed Wiring Boards – JOG/KEY/R. CNTL Boards – ..................................... 34 4-21. Schematic Diagram – JOG/KEY/R. CNTL Boards – ... 34 4-22. Schematic Diagram – POWER/AC/POWER SWITCH Boards – .................. 35 4-23. Printed Wiring Board – POWER Board (Component Side) – ........................... 36 4-24. Printed Wiring Boards – POWER (Conductor Side)/ AC/POWER SWITCH Boards – .................................... 37 4-25. IC Pin Function Description ........................................... 47 5. SERVICING NOTES (2) ........................................ 59 6. TEST MODE ............................................................... 60 7. EXPLODED VIEWS ................................................ 74 8. ELECTRICAL PARTS LIST ............................... 80CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. The following caution label is located inside the unit.
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3 The laser diode in the optical pick-up block may suffer electro- static break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emis- sion, observe from more than 30 cm away from the objective lens. SECTION 1 SERVICING NOTES (1) NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT HOW TO OPEN THE DISC TABLE WHEN POWER SWITCH TURNS OFF disc table loading panel assy tapering driver cover (CAM) 2 Draw out the loading panel assy in the direction of arrow B. 1 Insert a tapering driver in the hol e at the bottom of the unit, turn the cover (CAM) fully in the direction of arrow A. B A