Sony sa wms 25 service manual

Page 1

SA-WMSZS

SERVICE MANUAL

Ver 1.0 2002. 09

. SA-WMSZS is the subwoofer section in
HT-K25.

AEP Model
UK Model

E Model

SPECIFICATION

POWER OUTPUT

Rated Power Output at Stereo mode

(6 ohms 1 kHz, THD 0.7 %)

40W+40W

Reference Power Output
(THD 0.7 70)

Ftont*: 40 chh
Ccnlct": 40 W

Sunound*: 40 Wleh

(6 ohms)

Subwool'et: 70 W

(3 ohms)

* Depcnding on the sound field settings and the

Frequency response

20 Hz 7 20 kHz

Enclosure type

Speaker unit

Rated frequency range

30 Hz 7 200 Hz

High frequency cut-oil frequency
150 Hz

9-874-149-01 Sony Corporation
2002i1600-1 Home Audio Company
© 2002.09

Advanced S.A.W.
magnetically shiclded

3 source, there may be no sound output.
1 16 cm cone type

Published by Sony Engineering Corporation

Power requirements

Area code Power requirements
CEL, CEK, SP 2207230 V AC, 50/60 Hz
MX 120 V AC. 60 Hz

Power consumption 68 W

Power consumption (during standby mode)
0.8 W

224 X 318.5 X 344 mm
including front panel
7.] kg

Dimensions (w/h/d)
Mass (Approx.)

Design and specifications are subject to change
without notice.

NOTE:

~ Abbrc on

CEK : UK model
CEL : AEP model
MX : Mexican model

he specifications when connecting TAVVEZS.

suswoorrn
S ONY;

Page 2

SA-WMSZ5

TABLE OF CONTENTS

1. DISASSEMBLY
1_1_ DSP Board .................................................................. 3
1.2_ pg Board .................
1A3. DIGITAL AMP Board

2_ DIAGRAMS ................................................ 5
2-1. Block Diagrams 7 Power Section 7 -----
i DSP/AMP Section 7
2-2. Printed Wiring Boards
7 DIGITAL AMP Section (Side A) i ---------------------- 8
2-3. Printed Wiring Boards
7 DIGITAL AMP Section (Side B) i --------------------- 9
2-4. Schematic Diagram
7 DIGITAL AMP Section (1/2) 7 ------------------------ 10

2-5. Schematic Diagram

7 DIGITAL AMP Section (2/2) 7
2-6. Printed Wiring Board 7 PS Board (Side A) 7
2-7. Printed Wiring Board 7 PS Board (Side B) 7
2-8. Schematic Diagram 7 PS Board 7
2-9. Printed Wiring Board 7 DSP Board 7
2-10. Schematic Diagram 7 DSP Board (1/2) 7
2-11. Schematic Diagram 7 DSP Board (2/2) 7
2-12. IC Block Diagrams
2-13. IC Pin Function Description

.. 11
12
13
14
15
~16
17
18
20

3. EXPLODED VIEWS

3.1_ CabinetSection ........................................................... 24
3; AMP Section ............................................................... 25
4. ELECTRICAL PARTS LIST --------------------------------------- 26

SAFETY-RELATED COMPONENT WARNING I!

COMPONENTS IDENTIFIED BY MARK A OR DOTTED LINEWITH
MARK A ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.

Unleaded solder

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.

(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)

LEAD FREE MARK

Unleaded solder has the following characteristics.

' Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.

Ordinary soldering irons can be used but the iron tip has to be
applied to the solderjoint for a slightly longer time.

Soldering irons using a temperature regulator should be set to
about 350°C.

Caution: The printed pattern (copper foil) may peel away if the
heated tip ' applied for too long, so be careful!

Strong viscosity

Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.

Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

Notes on chip component replacement

' Never reuse a disconnected chip component.

' Notice that the minus side of a tantalum capacitor may be
damaged by heat