Sony RCD W50 C Service Manual
This is the 110 pages manual for Sony RCD W50 C Service Manual.
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Extracted text from Sony RCD W50 C Service Manual (Ocr-read)
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2 This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. T he following caution label is located inside the apparatus. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing - Keep the temperature of soldering iron around 270˚C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. RCD-W50C SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ! LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU D ANS LES SUPPÉMENTS PUBLIÉS PAR SONY. After correcting the original service problem, perform the following safety checks before releasing the set to the customer: Check the antenna terminals, metal trim, metallized knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below. LEAKAGE T he AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microamperes). Leakage current can be measured by any one of three methods. 1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers instructions to use these instruments. 2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job. 3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The limit indication is 0.75 V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2V AC range are suitable. (See Fig. A) SAFETY CHECK-OUT To Exposed Metal Par ts on Set 0.15 µ F 1.5 kΩ AC V oltmeter (0.75 V) Earth Ground Fig. A. Using an AC voltmeter to check AC leakage. MODEL IDENTIFICATION - BACK PANEL - Parts No. PA R TS No. MODEL 4-238-401-0 π 4-238-401-1π 4-238-401-3 π US Canadian E
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3 RCD-W50C TABLE OF CONTENTS 1. SERVICING NOTE ··················\ ··················\ ················· 4 2. GENERAL··················\ ··················\ ··················\ ············· 5 3. DISASSEMBLY ··················\ ··················\ ··················\ ···· 6 3-1. Case (409538) ··················\ ··················\ ··················\ ········· 7 3-2. Loading Panel (CDR) ··················\ ··················\ ··············· 7 3-3. Front Panel Section ··················\ ··················\ ··················\ · 8 3-4. CD-SW Board, LED Board, DISPLAY Board ············· 8 3-5. CD Mechanism Deck (CDM65-RBD1) ··················\ ····· 9 3-6. Tray ··················\ ··················\ ··················\ ··················\ ······· 9 3-7. CDR Board ··················\ ··················\ ··················\ ··········· 10 3-8. Holder (MG) Sub Assembly, Dust Cover ··················\ · 10 3-9. Optical Pick-Up (KRM-220CAA) ··················\ ············ 11 3-10. Motor Assembly (Loading) (M201) ··················\ ········· 11 3-11. Cam (CH) ··················\ ··················\ ··················\ ·············· 12 3-12. MAIN Board ··················\ ··················\ ··················\ ········· 12 3-13. CD Mechanism Deck (CDM53L-30B61B) ················ 13 3-14. Fitting Base (Magnet) Assembly ··················\ ·············· 13 3-15. CLAMP MOTOR Board, Motor (Clamp) Assembly (M701) ··················\ ············ 14 3-16. Fitting Base (Guide) Assembly, Bracket (Chassis) ····· 14 3-17. Tray (Sub) ··················\ ··················\ ··················\ ············· 15 3-18. Chassis (Mold B) ··················\ ··················\ ··················\ ·· 15 3-19. LOAD MOTOR Board, Motor (Loading) Assembly (M702) ··················\ ········· 16 3-20. Stocker Section ··················\ ··················\ ··················\ ····· 16 3-21. Slider (Selection), Tension Spring (Shutter), Slider (Shutter) ··················\ ··················\ ··················\ ······ 17 3-22. Gear (Gear A), Gear (Gear B), Gear (U/D Slider) ······ 17 Precaution During Gear (Gear U/D Slider), Gear (Gear B), Gear (Gear A) Installation ··················\ 18 3-23. Gear (Chucking) ··················\ ··················\ ··················\ ··· 18 3-24. BD Board ··················\ ··················\ ··················\ ·············· 19 3-25. Optical Block Section ··················\ ··················\ ············· 19 4. TEST MODE ··················\ ··················\ ··················\ ·············· 21 5. ELECTRICAL ADJUSTMENTS ··················\ ············· 24 CD SECTION ··················\ ··················\ ··················\ ······· 24 CD-R/RW SECTION ··················\ ··················\ ·············· 25 6. DIAGRAMS ··················\ ··················\ ··················\ ················ 55 6-1. Block Diagrams – CD-R Section – ··················\ ········· 56 – CD Section – ··················\ ············· 57 – POWER/DISPLAY Section – ······ 58 6-2. Printed Wiring Board – BD Section – ··················\ ······ 59 6-3. Schematic Diagram – BD Section – ··················\ ········· 60 6-4. Printed Wiring Board – SENSER/MOTOR/SW Section – ····· 61 6-5. Schematic Diagram – SENSER/MOTOR/SW Section – ····· 62 6-6. Printed Wiring Board – CD-R Section (Side A) – ······ 63 6-7. Printed Wiring Board – CD-R Section (Side B) – ······ 64 6-8. Schematic Diagram – CD-R Section (1/4) – ·············· 65 6-9. Schematic Diagram – CD-R Section (2/4) – ·············· 66 6-10. Schematic Diagram – CD-R Section (3/4) – ·············· 67 6-11. Schematic Diagram – CD-R Section (4/4) – ·············· 68 6-12. Printed Wiring Board – MAIN Section (Side A) – ····· 69 6-13. Printed Wiring Board – MAIN Section (Side B) – ····· 70 6-14. Schematic Diagram – MAIN Section (1/2) – ············· 71 6-15. Schematic Diagram – MAIN Section (2/2) – ············· 72 6-16. Printed Wiring Board – LED Section – ··················\ ···· 73 6-17. Schematic Diagram – LED Section – ··················\ ······· 74 6-18. Printed Wiring Board – DISPLAY Section – ············· 75 6-19. Schematic Diagram – DISPLAY Section – ················ 76 6-20. IC Block Diagrams ··················\ ··················\ ················· 77 6-21. IC Pin Functions Description ··················\ ··················\ ·· 80 7. EXPLODED VIEWS ··················\ ··················\ ··················\ 54 7-1. Case Section ··················\ ··················\ ··················\ ············ 90 7-2. Front Panel Section ··················\ ··················\ ··················\ · 91 7-3. Chassis Section ··················\ ··················\ ··················\ ······· 92 7-4. Overall Section (CDM53L-30B61B) ··················\ ·········· 93 7-5. Chassis (Mold) Assembly Section (CDM53L-30B61B) ·· 94 7-6. Chassis Section (CDM53L-30B61B) ··················\ ········· 95 7-7. Optical Block Section ··················\ ··················\ ··············· 96 7-8. CDM65-RBD1 ··················\ ··················\ ··················\ ········ 97 8. ELECTRICAL PARTS LIST ··················\ ··················\ ··· 98 Unleaded solder Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.
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