Sony nw ms 70 d service manual

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2 NW-MS70D Specifications ........................................................................\ ....... 1 1. SERVICING NOTES ....................................................... 3 2.GENERAL ........................................................................\ .. 3 3. TEST MODE ...................................................................... 4 4. DISASSEMBLY 4-1. Case (U) Sub Assy, Play Unit ......................................... 5 4-2. LCD Board ...................................................................... 5 4-3. Button (MS) Assy, Chassis (R) Assy .............................. 6 4-4. Ni-Mh Battery, Power Board .......................................... 6 4-5. Nand Board, Main Board ................................................ 7 5. DIAGRAMS 5-1. Block Diagrams ............................................................ 9 5-2. Schematic Diagram –Main Section (1/2)– .................. 10 5-3. Schematic Diagram –Main Section (2/2)– .................. 11 5-4. Printed Wiring Boards –Main Section– ...................... 12 5-5. Schematic Diagram –LCD Section– ........................... 13 5-6. Printed Wiring Boards –LCD Section– ...................... 14 5-7. Schematic Diagram –Nand Section– .......................... 15 5-8. Printed Wiring Boards –Nand Section– ...................... 16 5-9. Schematic Diagram –Power Section– ......................... 17 5-10. Printed Wiring Boards –Power Section– .................... 18 6. EXPLODED VIEW 6-1. Case Section .................................................................. 20 6-2. Chassis Section ............................................................. 21 7. ELECTRICAL PARTS LIST ....................................... 22 Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270 °C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. T ABLE OF CONTENTS z UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead-free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. z USABLE FORMAT Use ISO9660 Level 1 format. - IC401 (microcomputer), IC451 (frash RAM) on Main board cannot be replaced individually. Replace it with Main board assembly for service. - IC461, 463 (frash RAM) on NAND board cannot be replaced individually. Replace it with NAND board assembly for service. -W hen exchanging NAND board sub ASSY (for service),SL701 of the B-side may be open. In this case, please perform the solder bridge of SL701. OpenMG and its logo are trademarks of Sony Corporation. SonicStage and its logo are trademarks of Sony Corporation. MagicGate Memory Stick is trademark of Sony Corporation. Memory Stick and are trademarks of Sony Corporation. Memory Stick Duo and are trademarks of Sony Corporation. MagicGate and are trademarks of Sony Corporation. A TRAC, ATRAC3, ATRAC3plus and their logos are trademarks of Sony Corporation. Microsoft, Windows and Windows Media are trademarks or registered trademarks of Microsoft Corporation in the United States and/or other countries. US and foreign patents licensed from Dolby Laboratories. All other trademarks and registered trademarks are trademarks or registered trademarks of their respective holders. In this manual, TM and R marks are not specified. Ver 1.6