Sony nw e 503 service manual

Page 2

NW-E503/ E505/ E507

Supplied accessories

Headphones (1)
Dedicated USB cable (1)

Extension headphone cord (NW7E505/E507) (1)
Carrying pouch (NW7E505/E507) (1)

cup (1)

CD7ROM for the SonicStage software, PDF file
Operating Instructions. and PDF file SonicStage
Operating Instructions (1)

Quick Start Guide

Design and specifications are subject to
change without notice.

Microsoft, Windows and Windows Media are
trademarks or registered trademarks of Microsoft
Corporation in the United States and/or other
countries.

TABLE OF CONTENTS
1. GENERAL ................................................................... 3

2. DISASSEMBLY
2-1. Disassembly Flow
2-2. Lid (Connector)
213_ Cabinet (Inner)
2-4. Arm (Shuttle) ..
2-5. Knob (Shuttle)
2-6. MAIN Board ..
27. Organic El Indicator Module .

ocwqmmm

3. TEST MODE ............................................................... ll

4. DIAGRAMS
4-1. Block Diagram .................................................
4-2. Printed Wiring Board 7 MAIN Board (Side A) 7 ..
4-3. Primed Wiring Board 7 MAIN Board (Side B) 7 ........... 15
4-4. Schematic Diagram 7 SW Board, MAIN Board (1/5) 7 l6
4~5. Schematic Diagram 7 MAIN Board (2/5) 7 .
4-6. Schematic Diagram 7 MAIN Board (3/5)
4-7. Schematic Diagram 7 MAIN Board (4/5)
4~8. Schematic Diagram 7 MAIN Board (5/5)
49. Printed Wiring Board 7 SW Board 7 .....

. EXPLODED VIEWS
5-1. Overall-1
5-2. Overa1172

6. ELECTRICAL PARTS LIST .................................. 27

Flexible Circuit Board Repairing
- Keep the temperature of the soldering iron around 270 °C
during repairing.
a Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
- Be careful not to apply force on the conductor when soldering
or unsoldering.

Notes on chip component replacement
- Never reuse a disconnected chip component.
- Notice that the minus side of a tantalum capacitor may be
damaged by heat.

Microsoft, Windows and Windows Media are trademarks or
registered trademarks of Microsoft Corporation in the United States
and/or other countries.

US and foreign patents licensed from Dolby Laboratories.

All other trademarks and registered trademarks are trademarks or
registered trademarks of their respective holders.

UNLEADED SOLDER

Boards requiring use of unleaded solder are printed with the lead

free mark (LF) indicating the solder contains no lead.

(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)

IF: LEAD FREE MARK
Unleaded solder has the following characteristics.
- Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solderjoint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 DC.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
- Strong viscosity
Unleaded solder is more viscuu-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
- Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.