Sony nw e 5 service manual

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2 NW-E5 Specifications ............................................................................ 1 1. SERVICING NOTE ....................................................... 2 2. GENERAL ....................................................................... 3 3. DISASSEMBLY 3-1. Chassis ASSY, Case ASSY ......................................... 7 3-2. LID, Case .................................................................... 7 3-3. Main Board, Power Board .......................................... 7 3-4. LCD Unit .................................................................... 8 3-5. Button (Play/Stop), Holder (Knob,Spring), Knob (FF/REV) .......................................................... 8 4. TEST MODE ................................................................... 9 5. DIAGRAMS 5-1. Block Diagrams ......................................................... 11 5-2. Printed Wiring Boards (Main Section) ..................... 12 5-3. Schematic Diagram (Main Section (1/2)) ................. 13 5-4. Schematic Diagram (Main Section (2/2)) ................. 14 5-5. Printed Wiring Boards (Power Section) ................... 15 5-6. Schematic Diagram (Power Section) ........................ 16 6. EXPLODED VIEW 6-1. Main Section ............................................................. 21 6-2. Case Section ............................................................. 22 7. ELECTRICAL PARTS LIST ................................... 23 Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270°C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. TABLE OF CONTENTS - Replacement of CXD9534BGG (IC710) used in the set requires a special tool. r UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead-free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40°C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350°C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. SECTION 1 SERVICING NOTE