Sony nw e 002 f service manual
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2 NW-E002F/E003F/E005F TABLE OF CONTENTS 1. GENERAL ................................................................... 5 2. DISASSEMBLY 2-1. Disassembly Flow ........................................................... 6 2-2. Cabinet (Top) ................................................................... 7 2-3. Cabinet (Low) Assy ......................................................... 7 2-4. MAIN Board-1 ................................................................ 8 2-5. MAIN Board-2 ................................................................ 9 2-6. Battery (A) Assy .............................................................. 9 2-7. Organic EL Indicator Module ......................................... 10 2-8. SWITCH Board And Button (P/S) .................................. 11 3. TEST MODE ............................................................... 12 4. DIAGRAMS 4-1. Block Diagram ................................................................ 15 4-2. Printed Wiring Boards – MAIN, SWITCH Board (Side A) – .............................. 16 4-3. Printed Wiring Boards – MAIN, SWITCH Board (Side B) – .............................. 17 4-4. Schematic Diagram – MAIN Board (1/3) – ................... 18 4-5. Schematic Diagram – MAIN Board (2/3) – ................... 19 4-6. Schematic Diagram – MAIN Board (3/3), SWITCH Board – ......................... 20 5. EXPLODED VIEWS 5-1. Overall-1 ........................................................................\ .. 28 5-2. Overall-2 ........................................................................\ .. 29 5-3. Overall-3 ........................................................................\ .. 30 5-4. Overall-4 ........................................................................\ .. 31 6. ELECTRICAL PARTS LIST .................................. 32 UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscou-s (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270 °C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. - Microsoft, Windows, Windows NT and Windows Media are trademarks or registered trademarks of Microsoft Corporation in the United States and/or\ other countries. - Adobe and Adobe Reader are trademarks or registered trademarks of Adobe Systems Incorporated in the United States and/or other countries. - MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS and Thomson. - IBM and PC/AT are registered trademarks of International Business Machines Corporation. - Macintosh is a trademark of Apple Computer, Inc.. - Pentium is a trademark or a registered trademark of Intel Corporation. - CD and music-related data from Gracenote, Inc., copyright © 2000-2004 Gracenote. Gracenote CDDB ® Client Software, copyright 2000-2004 Gracenote. This product and service may practice one or more of the following U.S. Patents: #5,987,525; #6,061,680; #6,154,773, #6,161,132, #6,230,192, #6,230,207, \ #6,240,459, #6,330,593, and other patents issued or pending. Services supplied and/or device manufactured under license for following Open Globe,Inc. United States Patent 6,304,523. Gracenote and CDDB are registered trademarks of Gracenote. The Gracenote logo and logotype, and the Powered by Gracenote logo are trademarks of Gracenote. Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be damaged by heat.
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3 NW-E002F/E003F/E005F Fig-1 Fig-2 NOTES ON ARRANGE THE OEL MODULE FLEXIBLE CABLE pre-fold SHEET (OEL-FPC), ADHESIVE Remove protection sheet. f olding line segment portion SPACER (OEL) 1. Pre-fold the flexible cable as in Fig-1. 3. Make sure it does not cover the segment portion as in Fig-2. 2. Affix at the center of folding line and remove release SHEET (OEL-FPC), ADHESIVE. Fold and press fit at the area of SHEET (OEL-FPC), ADHESIVE. Remove protection sheet from OLED. 3mm 4.5mm T ABLE OF DESTINATION AND COLOR VARIATION US NW-E002F NW-E003F BLACK SILVER PINK VIOLET GREEN BLUE CND AEP E KR MX US CND AEP CEV E KR MX NW-E005F US CND E KR MX - Abbreviation CEV : Poland, Czech, Greece and Turkey models CND : Canadian model KR : Korean model MX : Mexican model