Sony nascz 1 service manual
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Extracted text from sony nascz 1 service manual (Ocr-read)
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2 HCD-CZ1/NAS-CZ1 Notes on chip component replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing -Keep the temperature of the soldering iron around 270 C during repairing. -Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). -Be careful not to apply force on the conductor when soldering or unsoldering. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. SAFETY CHECK-OUT After correcting the original service problem, perform the following safety check before releasing the set to the customer: Check the antenna terminals, metal trim, metallized knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below. LEAKAGE TEST The AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microamperes.). Leakage current can be measured by any one of three methods. 1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers instructions to use these instruments. 2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job. 3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The limit indication is 0.75 V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2 V AC range are suitable. (See Fig. A) Fig. A. Using an AC voltmeter to check AC leakage. 1.5 k Ω 0.15 µF AC voltmete r (0.75 V) To Exposed Metal Parts on Set Earth Ground SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. The following caution label is located inside the unit. This appliance is classified as a CLASS 1 LASER product. This marking is located on the bottom exterior.
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3 HCD-CZ1/NAS-CZ1 TABLE OF CONTENTS 1. SERVICE NOTE ................................................................. 4 2. GENERAL .......................................................................... 15 3. DISASSEMBLY 3-1. Disassembly Flow ............................................................ 17 3-2. Speaker Grill (F/R) Assy, Top Panel Assy ........................ 18 3-3. Cover Bottom Assy ........................................................... 18 3-4. Rear Panel Section ............................................................ 19 3-5. Front Panel Section .......................................................... 20 3-6. Top Panel Section ............................................................. 20 3-7. Base Unit (BU-K7BD81B) .............................................. 21 3-8. MAIN Board Section ........................................................ 21 3-9. ETHER Board, MAIN Board ........................................... 22 4. TEST MODE ...................................................................... 23 5. ELECTRICAL ADJUSTMENTS ................................. 26 6. DIAGRAMS 6-1. Block Diagram – SERVO Section – ................................ 27 6-2. Block Diagram – Ethernet Section – ............................... 28 6-3. Block Diagram – MAIN Section – .................................. 29 6-4. Printed Wiring Board – CD Board – .............................. 31 6-5. Schematic Diagram – CD Board – .................................. 32 6-6. Printed Wiring Board – ETHER Board – ........................ 33 6-7. Schematic Diagram – ETHER Board – ........................... 34 6-8. Printed Wiring Board – MAIN Board (Component Side) – ................................ 35 6-9. Printed Wiring Board – MAIN Board (Conductor Side) – .................................. 36 6-10. Schematic Diagram – MAIN Board (1/2) – .................... 37 6-11. Schematic Diagram – MAIN Board (2/2) – .................... 38 6-12. Printed Wiring Boards – Power Section – ....................... 39 6-13. Schematic Diagram – Power Section – ........................... 40 6-14. Printed Wiring Boards – Panel Section – ........................ 41 6-15. Schematic Diagram – Panel Section – ............................ 42 6-16. Printed Wiring Board – FL Board – ................................ 43 6-17. Schematic Diagram – FL Board – ................................... 44 7. EXPLODED VIEWS 7-1. Speaker Grill, Top Panel Section ...................................... 54 7-2. Front Panel Section .......................................................... 55 7-3. Rear Panel Section ............................................................ 56 7-4. CD Panel Section .............................................................. 57 7-5. PSAMP Board Section ..................................................... 58 7-6. MAIN Board Section ........................................................ 59 7-7. Base Unit (BU-K7BD81B) .............................................. 60 8. ELECTRICAL PARTS LIST ......................................... 61