Sony mz s 1 service manual

Page 2

3 MZ-S1 TABLE OF CONTENTS 1. SERVICING NOTES ............................................... 4 2. GENERAL ................................................................... 6 3. DISASSEMBLY 3-1. Disassembly Flow ........................................................... 7 3-2. Case (Lower) Section ...................................................... 8 3-3. Buckle (Upper) Assy, Battery Case Lid ......................... 9 3-4. Case (Upper) Section ...................................................... 10 3-5. Mechanism Deck (MT-MZN707-177) ........................... 10 3-6. Set Chassis Assy ............................................................. 11 3-7. MAIN Board ................................................................... 11 3-8. OP Service Assy (LCX-5R) ............................................ 12 3-9. Holder Assy ..................................................................... 13 3-10. DC Motor (Sled) (M602) ................................................ 13 3-11. DC SSM18B Motor (Spindle) (M601), DC Motor (Over Write Head Up/Down) (M603) .......... 14 3-12. Ornament (R), Switch Unit ............................................. 14 4. TEST MODE .............................................................. 15 5. ELECTRICAL ADJUSTMENTS ......................... 20 6. DIAGRAMS 6-1. Block Diagram – SERVO/USB Section –...................... 32 6-2. Block Diagram – AUDIO Section –............................... 33 6-3. Block Diagram – DISPLAY/KEY CONTROL/ POWER SUPPLY Section –........................................... 34 6-4. Note for Printed Wiring Board and Schematic Diagrams ....................................................... 35 6-5. Printed Wiring Board – MAIN Board (Component Side) –............................. 36 6-6. Printed Wiring Board – MAIN Board (Conductor Side) –............................... 37 6-7. Schematic Diagram – MAIN Board (1/4) –.................. 38 6-8. Schematic Diagram – MAIN Board (2/4) –.................. 39 6-9. Schematic Diagram – MAIN Board (3/4) –.................. 40 6-10. Schematic Diagram – MAIN Board (4/4) –.................. 41 6-11. IC Pin Function Description ........................................... 48 7. EXPLODED VIEWS 7-1. Case (Upper) Section ...................................................... 55 7-2. Chassis Section ............................................................... 56 7-3. MAIN Board Section ...................................................... 57 7-4. Case (Lower) Section-1 .................................................. 58 7-5. Case (Lower) Section-2 .................................................. 59 7-6. Mechanism Deck Section-1 (MT-MZN707-177) ........... 60 7-7. Mechanism Deck Section-2 (MT-MZN707-177) ........... 61 8. ELECTRICAL PARTS LIST ............................... 62 CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. Notes on chip component replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing -Keep the temperature of the soldering iron around 270 ˚C dur- ing repairing. -Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). -Be careful not to apply force on the conductor when soldering or unsoldering. UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. -Unleaded solder melts at a temperature about 40 ˚C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 ˚C . Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! -Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. -Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. On power sources -Use house current, LR6 (size AA) battery. -For use in your house: Use the AC power adaptor supplied with this recorder. Do not use any other AC power adaptor since it may cause the recorder to malfunction. Polarity of the plug