Sony mz nf 520 d service manual

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3 MZ-NF520D CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. Notes on chip component replacement -Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing -K eep the temperature of the soldering iron around 270 ˚C dur- ing repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40 ˚C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 ˚C . Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. 1. SERVICING NOTES ....................................................... 4 2. GENERAL ........................................................................\ .. 5 3. DISASSEMBLY 3-1. Disassembly Flow.......................................................... 6 3-2. Case (Low er).................................................................. 7 3-3. MAIN Board ................................................................... 7 3-4. Panel (Upper) Section.................................................... 8 3-5. LCD Module, Button (Control)..................................... 8 3-6. Mechanism Deck (MT-MZN710-177).......................... 9 3-7. Set Chassis Assy............................................................. 9 3-8. OP Service Assy (LCX-5R) ......................................... 10 3-9. Holder Assy .................................................................. 11 3-10. DC Motor (Sled) (M602)........................................... 11 3-11. DC Motor (Over Write Head Up/Down) (M603), DC SSM18B Motor (Spindle) (M601)...................... 12 4. TEST MODE .................................................................... 13 5. ELECTRICAL ADJUSTMENTS ............................... 18 6. DIAGRAMS 6-1. Block Diagram ............................................................. 37 6-2. Printed Wiring Board - MAIN Board (Side A)........... 39 6-3. Printed Wiring Board - MAIN Board (Side B)........... 40 6-4. Schematic Diagram - MAIN Board (1/4).................... 41 6-5. Schematic Diagram - MAIN Board (2/4).................... 42 6-6. Schematic Diagram - MAIN Board (3/4).................... 43 6-7. Schematic Diagram - MAIN Board (4/4).................... 44 6-8. IC Pin Function Description........................................ 49 7. EXPLODED VIEWS 7-1. Case Section ................................................................. 55 7-2. Chassis Section ............................................................. 56 7-3. MAIN Board Section................................................... 57 7-4. Mechanism Deck Section-1 (MT-MZN710-177) ........ 58 7-5. Mechanism Deck Section-2 (MT-MZN710-177) ........ 59 8. ELECTRICAL PARTS LIST ....................................... 60 TABLE OF CONTENTS