Sony mz n 10 service manual
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2 MZ-N10 CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. Notes on chip component replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing -Keep the temperature of the soldering iron around 270 ˚C dur- ing repairing. -Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). -Be careful not to apply force on the conductor when soldering or unsoldering. UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. -Unleaded solder melts at a temperature about 40 ˚C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 ˚C . Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! -Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. -Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. On power sources -Use house current, nikel metal hydride rechargeable battery, LR6 (SG) battery, or car battery. -For use in your house: For the supplied battery charging stand, use the AC power adaptor supplied with this recorder. Do not use any other AC power adaptor since it may cause the recorder to malfunction Polarity of the plug SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY. Optical cable (1) CD-ROM (SonicStage Ver. 1.5) (1)* Carrying pouch/carrying case with a belt clip (except USA model) (1) Recordable MD (USA and Canada models only) (1) ∗Do not play a CD-ROM on an audio CD player. Headphones/earphones with a remote control (1) DimensionsApprox. 78.5 × 73.3 × 13.8 mm (w/h/d) (31/8× 3 × 9/16 in.) (excluding projecting parts and controls ) MassApprox. 84 g (3 oz) (including the built-in rechargeable battery) 1)The LINE IN (OPT) jack is used to connect either a digital (optical) cable or a line (analog) cable. 2)The i/LINE OUT jack connects either headphones/earphones or a line cable. 3)Measured in accordance with JEITA. US and foreign patents licensed from Dolby Laboratories. Design and specifications are subject to change without notice.4)Measured in accordance with the JEITA (Japan Electronics and Information Technology Industries Association) standard. 5)When using a 100% fully charged built-in lithiun-ion rechargeable battery. 6)When using a Sony LR6 (SG) STAMINA alkaline dry battery (produced in Japan). Supplied accessoriesAC power adaptor (1) USB cradle (1) Dedicated USB cable (1) Dry battery case (1) -SonicStage, OpenMG and the OpenMG logo, MagicGate, Memory Stick and the MagicGate Memory Stick logo, Memory Stick and the Memory Stick logo, Net MD and the Net MD logo are trademarks of Sony Corporation. -Microsoft, Windows, Windows NT and Windows Media are trademarks or registered trademarks of Microsoft Corporation in the United States and /or other countries. -IBM and PC/AT are registered trademarks of International Business Machines Corporation. -Macintosh is a trademark of Apple Computer, Inc. in the United States and/ or other countries. -MMX and Pentium are trademarks or registered trademarks of Intel Corporation. -All other trademarks and registered trademarks are trademarks or registered trademarks of their respective holders. -™ and ® marks are omitted in this manual. Ver 1.2 2003.02 ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ! LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
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3 MZ-N10 TABLE OF CONTENTS 1. SERVICING NOTES ............................................... 4 2. GENERAL ................................................................... 5 3. DISASSEMBLY ......................................................... 6 3-1. Bottom Panel Section, Jog Dial Section......................... 7 3-2. Upper Panel Section........................................................ 7 3-3. MAIN Board Section...................................................... 8 3-4. MD Mechanism Deck (MT-MZN10-181), Set Chassis...................................................................... 8 3-5. Gear (SA), Gear (SB)...................................................... 9 3-6. OP Service Assy (ABX-1R)........................................... 9 3-7. DC Motor SSM21A (Sled) (M602), DC Motor SSM18D (Spindle) (M601), DC Motor Unit (Over Write Head Up/Down) (M603)............................................................................. 10 3-8. Holder Assy..................................................................... 10 4. TEST MODE .............................................................. 11 5. ELECTRICAL ADJUSTMENTS ......................... 17 6. DIAGRAMS 6-1. Block Diagram................................................................ 37 6-2. Note for Printed Wiring Board and Schematic Diagrams....................................................... 38 6-3. Printed Wiring Board – MAIN Board (Side A) –......................................... 39 – MAIN Board (Side B) –......................................... 40 6-4. Schematic Diagrams – MAIN Board (1/4) –............................................... 41 – MAIN Board (2/4) –............................................... 42 – MAIN Board (3/4) –............................................... 43 – MAIN Board (4/4) –............................................... 44 6-5. IC Pin Function Description........................................... 49 7. EXPLODED VIEWS 7-1. Upper Panel Section........................................................ 55 7-2. Bottom Panel Section...................................................... 56 7-3. Chassis Section............................................................... 57 7-4. MD Mechanism Deck Section (MT-MZN10-181)........ 58 8. ELECTRICAL PARTS LIST ............................... 59