Sony mz e 900 service manual
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Extracted text from sony mz e 900 service manual (Ocr-read)
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2 MZ-E900 Specifications ........................................................................... 1 1. SERVICING NOTE ...................................................... 2 2. GENERAL Location and Function of Controls .................................... 3 3. DISASSEMBLY 3-1. Lid ASSY, Upper, Holder ASSY ............................ 4 3-2. Mechanism Deck ........................................................ 4 3-3. Audio Board ................................................................ 5 3-4. Bracket (L) ASSY, Bracket (R) ASSY ....................... 5 3-5. Main Board, Bracket (L) ASSY, SW Board ............... 6 3-6. Optical Pick-up ASSY ................................................ 6 4. TEST MODE .................................................................. 7 5. ELECTRICAL ADJUSTMENTS ............................ 11 6. DIAGRAMS 6-1. Block Diagram .......................................................... 15 6-2. Printed Wiring Boards – Main Section (1/2) – ......... 16 6-3. Printed Wiring Boards – Main Section (2/2) – ......... 17 6-4. Schematic Diagram – Main Section (1/2) – ............. 18 6-5. Schematic Diagram – Main Section (2/2) – ............. 19 6-6. Printed Wiring Boards – Audio Section – ................ 20 6-7. Schematic Diagram – Audio Section – ..................... 21 7. EXPLODED VIEWS 7-1. Front Section ............................................................ 25 7-2. Mechanism Deck Section ......................................... 26 8. ELECTRICAL PARTS LIST ................................... 27 SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK !ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270°C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. TABLE OF CONTENTS SECTION 1 SERVICING NOTE When repairing this device with the power on, if you remove the main board, this device stops working. In this case, you work without the device stopping by fastening the hook of the Open/Close detection switch (S809). * Replacement of CXD2671-201GA (IC601) used in this set requires a special tool. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Open/Close detection switch (S809) Mechanism deck sectio n r UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead-free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40°C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350°C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. Ver 1.1 2001.01
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3 MZ-E900 SECTION 2 GENERAL This section is extracted from instruction manual. Ver 1.1 2001.01