Sony mz e 510 service manual
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Extracted text from sony mz e 510 service manual (Ocr-read)
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2 Flexible Circuit Board Repairing -Keep the temperature of the soldering iron around 270°C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be damaged by heat. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous r adiation exposure. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PA RT NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. MZ-E510 On power sources - Use house current, LR6 (size AA) battery, or car battery. - For use in your house: Use the AC power adaptor supplied with this recorder. Do not use any other AC power adaptor since it may cause the recorder to malfunction. - Connect the AC power adaptor to an easily accessible AC outlet. Should you notice an abnormality in the AC power adaptor, disconnect it from the AC outlet immidiately. - The recorder is not disconnected from the AC power source (mains) as long as it is connected to the wall outlet, even if the recorder itself has been turned off. - If you are not going to use this recorder for a long time, be sure to disconnect the power supply (AC power adaptor, dry battery, or car battery cord). To remove the AC power adaptor from the wa ll outlet, grasp the adaptor plug itself; n ever pull the cord. Polarity of the plug *Replacement of IC501, IC601 used in this set requires a special tool. - The voltage and waveform of CSP (chip size package) can- not be measured, because its lead layout is different from that of conventional IC. - Lead layouts Unleaded solder Boards requiring use of unleaded solder are printed with the lead-free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40°C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350°C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. surface Lead layout of conventional IC CSP (chip size package)
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3 TABLE OF CONTENTS MZ-E510 1. SERVICING NOTE ......................................................... 4 2. GENERAL ........................................................................\ . 5 3. DISASSEMBLY 3-1. Upper Panel, Holder Assy ............................................. 6 3-2. Mechanism Deck (MT-MZE710-183) ........................... 7 3-3. MAIN Board, Bracket (L) Assy, Bracket (R) Assy ....... 7 3-4. OP Service Assy (ABX-1E) .......................................... 8 4. TEST MODE .............................................................. 9 5. ELECTRICAL ADJUSTMENTS ............................. 14 6. DIAGRAMS 6-1. Block Diagrams ........................................................... 27 6-2. Printed Wiring Boards - MAIN Board (Side A) - ........ 28 6-3. Printed Wiring Boards - MAIN Board (Side B) - ........ 29 6-4. Schematic Diagrams - MAIN Board (1/4) - ................ 30 6-5. Schematic Diagrams - MAIN Board (2/4) - ................ 31 6-6. Schematic Diagrams - MAIN Board (3/4) - ................ 32 6-7. Schematic Diagrams - MAIN Board (4/4) - ................ 33 6-8. IC Block Diagrams ...................................................... 34 6-9. IC Pin Function Description ........................................ 36 7.EXPLODED VIEWS 7-1. Case Section ................................................................ 40 7-2. Mechanism Deck Section (MT-MZE710-183) ............ 41 8.ELECTRICAL PARTS LIST ...................................... 42