Sony mz e 501 service manual
This is the 36 pages manual for sony mz e 501 service manual.
Read or download the pdf for free. If you want to contribute, please upload pdfs to audioservicemanuals.wetransfer.com.
Extracted text from sony mz e 501 service manual (Ocr-read)
Page 1
2 MZ-E501 1. SERVICING NOTE···················································· 3 2. GENERAL·································································· 4 3. DISASSEMBLY 3-1. Case Assy, Holder Assy ·················································· 5 3-2. Mechanism Deck ···························································· 6 3-3. Bracket Assy ··································································· 6 3-4. Main Board ····································································· 7 3-5. Optical Pick-up Assy (LCX-4E) ····································· 7 4. TEST MODE······························································ 8 5. ELECTRICAL ADJUSTMENTS··························· 12 6. DIAGRAMS 6-1. Block Diagram ······························································ 17 6-2. Printed Wiring Board – Main Section (Side A) – ········· 18 6-3. Printed Wiring Board – Main Section (Side B) – ········· 19 6-4. Schematic Diagram – Main Section (1/3) – ·················· 20 6-5. Schematic Diagram – Main Section (2/3) – ·················· 21 6-6. Schematic Diagram – Main Section (3/3) – ·················· 22 6-7. IC Block Diagrams ······················································· 23 6-8. IC Pin Function Description ········································· 25 7. EXPLODED VIEWS 7-1. Main Section ································································· 31 7-2. Mechanism Deck Section ············································· 32 8. ELECTRICAL PARTS LIST·································· 33 Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270°C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Unleaded solder Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. -Unleaded solder melts at a temperature about 40°C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350°C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! -Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. -Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK !ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. TABLE OF CONTENTS CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.
Page 2
3 MZ-E501 * Replacement of CXD2671-205GA (IC601) used in this set requires a special tool. When repairing this device with the power on, if you remove the main board, this device stops working. In this case, you work without the device stopping by fastening the hook of the Open/Close detection switch (S809). SECTION 1 SERVICING NOTES NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK Never look into the laser diode emission from right above when checking it for adjustment. It is feared that you will lose your sight. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK (LCX-4E) The laser diode in the optical pick-up block may suffer electrostatic break-down easily. When handling it, perform soldering bridge to the laser-tap on the flexible board. Also perform measures against electrostatic break-down sufficiently before the operation. The flexible board is easily damaged and should be handled with care. OPTICAL PICK-UP FLEXIBLE BOARD laser-tap Open/Close detection switch (S809)