Sony mz e 500 service manual
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Extracted text from sony mz e 500 service manual (Ocr-read)
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- 2 - 1. SERVICING NOTE···················································· 3 2. GENERAL·································································· 4 3. DISASSEMBLY 3-1. Panel Block Assy, Upper, Holder Assy ································································· 5 3-2. Mechanism Deck ···························································· 5 3-3. Bracket Assy ··································································· 6 3-4. Main Board ····································································· 6 3-5. Optical Pick-up Block ···················································· 7 4. TEST MODE······························································ 8 5. ELECTRICAL ADJUSTMENTS··························· 12 6. DIAGRAMS 6-1. Block Diagram ······························································ 17 6-2. Printed Wiring Boards – Main Section (1/2) – ············· 19 6-3. Printed Wiring Boards – Main Section (2/2) – ············· 21 6-4. Schematic Diagram – Main Section (1/3) – ·················· 23 6-5. Schematic Diagram – Main Section (2/3) – ·················· 25 6-6. Schematic Diagram – Main Section (3/3) – ·················· 27 6-7. IC Block Diagrams ······················································· 29 6-8. IC Pin Function Description ········································· 31 7. EXPLODED VIEWS 7-1. Main Section ································································· 37 7-2. Mechanism Deck Section (MT-MZE500-174) ············· 38 8. ELECTRICAL PARTS LIST·································· 39 SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK !ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270°C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. TABLE OF CONTENTS CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.
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- 3 - * Replacement of CXD2671-203GA (IC601) used in this set requires a special tool. When repairing this device with the power on, if you remove the main board, this device stops working. In this case, you work without the device stopping by fastening the hook of the Open/Close detection switch (S809). SECTION 1 SERVICING NOTES NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK Never look into the laser diode emission from right above when checking it for adjustment. It is feared that you will lose your sight. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK (LCX-4E) The laser diode in the optical pick-up block may suffer electrostatic break-down easily. When handling it, perform soldering bridge to the laser-tap on the flexible board. Also perform measures against electrostatic break-down sufficiently before the operation. The flexible board is easily damaged and should be handled with care. OPTICAL PICK-UP FLEXIBLE BOARD laser-tap Open/Colse detection switch (S809)