Sony mex r 1 service manual

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3 MEX-R1 The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK Never look into the laser diode emission from right above when checking it for adjustment. It is feared that you will lose your sight. SECTION 1 SERVICING NOTES NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. -Unleaded solder melts at a temperature about 40 ˚C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 ˚C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! -Strong viscosity Unleaded solder is more viscou-s (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. -Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. MODEL IDENTIFICATION Label indication Signal format Region Par t No.Destination system code PAL22-581-683-01 AEP, UK models PAL42-586-472-01 E: PAL, Korean models NTSC 3 2-586-473-01 E: NTSC model NOTE FOR FLEXIBLE BOARD OF THE OPTICAL PICK-UP When connecting or disconnecting the flexible board of the optical pick-up to or from the CN2 of the SERVO board, follow the procedure given below. Figure 1 Note:When soldering the short lands, solder within 5 seconds at the temperature of soldering iron below 300°C. Disconnection: 1. Solder the lands 3 and 2 to short. 2. Solder the lands 1 and 2 to short. 3. Disconnect the flexible board. (Unsolder the shorted lands) Connection: 1. Make sure that the lands 1, 2, and 3 of the flexible board to be connected are soldered to short. (*1) 2. Connect the flexible board to the CN2 of the SERVO board. 3. Unsolder the lands 1 and 2. (*2) 4. Unsolder the lands 3 and 2. (*2) 5. Make sure that the respective lands are open surely. *1) If the lands concerned are not soldered to short, first solder the lands 3 and 2, and then lands 1 and 2 to short in this order. *2) When unsoldering the lands, move the soldering iron in bottom to top direction in Figure 1 so that the solder runs away into the land 4 (solder reservoir) for easy unsoldering. NOTE FOR OPERATION CHECK WITH THE BASE BOARD DISCONNECTED This set detects whether the front panel is opened or closed by using the S961 of the BASE board. If the BASE board is disconnected, the S961 is turned off (panel closed status) and the disc is not ejected. To perform the disc ejecting operation with the BASE board disconnected, turn on the S961. NOTE FOR REPLACING THE MOUNTED MAIN BOARD If the mounted MAIN board was replaced, be sure refer to Technical News published separately. – Bottom View – Part Number Region Code 4 2 1Flexible board of the optical pick-up SERVO board CN 2 3