Sony mex bt 2500 service manual
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Extracted text from sony mex bt 2500 service manual (Ocr-read)
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2 MEX-BT2500 Notes on chip component replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be damaged by heat. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. This label is located on the bottom of the - AEP, UK and E models: chassis. Flexible Circuit Board Repairing -Keep the temperature of the soldering iron around 270 ˚C during repairing. -Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). -Be careful not to apply force on the conductor when soldering or unsoldering. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY. Wireless CommunicationCommunication System: Bluetooth Standard version 2.0 Output: Bluetooth Standard Power Class 2 (Max. +4 dBm) Maximum communication range: Line of sight approx. 10 m (32.8 ft)* 1 Frequency band: 2.4 GHz band (2.4000 – 2.4835 GHz) Modulation method: FHSS Compatible Bluetooth Profiles* 2: A2DP (Advanced Audio Distribution Profile) AVRCP (Audio Video Remote Control Profile) HFP (Handsfree Profile) 1.0 HSP (Headset Profile) *1The actual range will vary depending on factors such as obstacles between devices, magnetic fields around a microwave oven, static electricity, reception sensitivity, antenna's perfomance, operating system, software application, etc. *2Bluetooth standard profiles indicate the purpose of Bluetooth communication between devices. Power amplifier sectionOutputs: Speaker outputs (sure seal connectors) Speaker impedance: 4 – 8 ohms Maximum power output: 52 W × 4 (at 4 ohms) GeneralOutput: Power antenna (aerial) relay control terminal Inputs: Antenna (aerial) input terminal AUM input jack (stereo mini jack) Tone controls: Low: ±10 dB at 100 Hz (XPLOD) High: ±10 dB at 10 kHz (XPLOD) Loudness: + 9 dB at 100 Hz + 5 dB at 10 kHz Power requirements: 12 V DC car battery (negative ground (earth)) Dimensions: Approx. 178 × 50 × 179 mm (7 1/8 × 2 × 7 1/8 in) (w/h/d) MWTuning range: 531 – 1,602 kHz (at 9 kHz step) 530 – 1,710 kHz (at 10 kHz step) MW tuning interval: 9kHz/10kHz switchable Antenna (aerial) terminal: External antenna (aerial) connector Intermediate frequency: 10.7 MHz/450 kHz Sensitivity: 30 µV SWTuning range: SW1: 2,940 – 7,735 kHz SW2: 9,500 – 18,135 kHz (except for 10,140 – 11,575 kHz) Antenna (aerial) terminal: External antenna (aerial) connector Intermediate frequency: 10.7 MHz/450 kHz Sensitivity: 30 µV Intermediate frequency: 10.7 MHz/450 kHz Usable sensitivity: 9 dBf Selectivity: 75 dB at 400 kHz Signal-to-noise ratio: 67 dB (stereo), 69 dB (mono) Harmonic distortion at 1 kHz: 0.5 % (stereo), 0.3 % (mono) Separation: 35 dB at 1 kHz Frequency response: 30 – 15,000 Hz Mounting dimensions: Approx. 182 × 53 × 162 mm (7 1/4 × 2 1/8 × 6 1/2 in) (w/h/d) Mass: Approx. 1.2 kg (2 lb 11 oz) Supplied accessory: Card remote commander: RM-X304 Parts for installation and connections (1 set) Design and specifications are subject to change without notice. MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS and Thomson. The use of optical instruments with this product - US and Canadian models: will increase eye hazard.CAUTION
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3 MEX-BT2500 TABLE OF CONTENTS 1. SERVICING NOTES ............................................... 4 2. GENERAL ................................................................... 7 3. DISASSEMBLY 3-1. Disassembly Flow ........................................................... 17 3-2. Cover ........................................................................\ ....... 17 3-3. CD Mechanism Deck Block (MG-101TA-188//Q) ......... 18 3-4. ANTENNA Board ........................................................... 18 3-5. MAIN Board .................................................................... 19 3-6. SERVO Board .................................................................. 19 3-7. Chassis (T) Sub Assy ....................................................... 20 3-8. Roller Arm Assy .............................................................. 20 3-9. Chassis (OP) Assy ........................................................... 21 3-10. Chucking Arm Sub Assy ................................................. 21 3-11. Sled Motor Assy .............................................................. 22 3-12. Optical Pick-Up Section .................................................. 23 3-13. OP Service Assy (DAX-25A) .......................................... 23 4. TEST MODE .............................................................. 24 5. DIAGRAMS 5-1. Printed Wiring Boards – MAIN Section – ...................... 28 5-2. Schematic Diagram – MAIN Section (1/3) – .................. 29 5-3. Schematic Diagram – MAIN Section (2/3) – .................. 30 5-4. Schematic Diagram – MAIN Section (3/3) – .................. 31 5-5. Printed Wiring Board – KEY Board – ............................. 32 5-6. Schematic Diagram – KEY Board – ............................... 33 6. EXPLODED VIEWS 6-1. Main Section .................................................................... 38 6-2. Front Panel Section ......................................................... 39 6-3. CD Mechanism Deck Section-1 (MG-101TA-188//Q) ... 40 7. ELECTRICAL PARTS LIST ................................ 41