Sony mdx f 5800 service manual
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Extracted text from sony mdx f 5800 service manual (Ocr-read)
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2 MDX-F5800 Notes on chip component replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing -Keep the temperature of the soldering iron around 270 °C dur- ing repairing. -Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). -Be careful not to apply force on the conductor when soldering or unsoldering. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY. 1. SERVICING NOTES ............................................... 3 2. GENERAL Location of Controls....................................................... 4 3. DISASSEMBLY 3-1. Disassembly Flow........................................................... 11 3-2. Sub Panel Assy................................................................ 12 3-3. Mechanism Deck (MG-165A-138)................................ 12 3-4. MAIN Board................................................................... 13 3-5. SERVO Board................................................................. 13 3-6. MD Cover Assy............................................................... 14 3-7. Float Block...................................................................... 14 3-8. Lever (LE23) Assy.......................................................... 15 3-9. Holder Assy..................................................................... 15 3-10. Chucking Arm Assy........................................................ 16 3-11. Optical Pick-up (KMS-242E)......................................... 16 3-12. SL Motor Assy (Sled) (M902), SP Motor Assy (Spindle) (M901)................................... 17 4. ELECTRICAL ADJUSTMENTS Test Mode........................................................................ 17 MD Section..................................................................... 17 Tuner Section.................................................................. 17 5. DIAGRAMS 5-1. Block Diagram – SERVO Section –............................... 18 5-2. Block Diagram – MAIN Section –................................. 19 5-3. Block Diagram – PANEL/BUS CONTROL/ POWER SUPPLY Section –........................................... 20 5-4. Note for Printed Wiring Boards and Schematic Diagrams....................................................... 21 5-5. Schematic Diagram – SERVO Section (1/2) –............... 22 5-6. Schematic Diagram – SERVO Section (2/2) –............... 23 5-7. Printed Wiring Boards – SERVO Section –................... 24 5-8. Printed Wiring Boards – MAIN Section –..................... 25 5-9. Schematic Diagram – MAIN Section (1/3) –................. 26 5-10. Schematic Diagram – MAIN Section (2/3) –................. 27 5-11. Schematic Diagram – MAIN Section (3/3) –................. 28 5-12. Printed Wiring Board – SUB Board –............................ 29 5-13. Schematic Diagram – SUB Board –............................... 29 5-14. Printed Wiring Board – KEY Board –............................ 30 5-15. Schematic Diagram – KEY Board –.............................. 31 6. EXPLODED VIEWS 6-1. Chassis Section............................................................... 45 6-2. Front Panel Section......................................................... 46 6-3. Mechanism Deck Section-1 (MG-165A-138)................ 47 6-4. Mechanism Deck Section-2 (MG-165A-138)................ 48 6-5. Mechanism Deck Section-3 (MG-165A-138)................ 49 7. ELECTRICAL PARTS LIST ............................... 50 TABLE OF CONTENTS This label is located on the bottom of the chassis. This product is classified as a CLASS 1 LASER PRODUCT. CAUTION INVISIBLE DO NOT STARE INTO BEAM OR VIEW DIRECTLY WITH OPTICAL INSTRUMENTS LASER RADIATION WHEN OPEN This label is located on the drive units internal chassis. (Refer to below figure) Caution label – Upper view – During service do not take the Optical Pick-up Block apart and do not adjust the APC circuit. If there is a breakdown in the APC circuit (including laser diode), replace the entire Optical Pick-up Block (including SERVO board).
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3 MDX-F5800 NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT T he laser diode in the optical pick-up block may suffer electro- static break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. T he flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK Never look into the laser diode emission from right a vove when checking it for adustment. It is feared that you will lose your sight. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK (KMS-242E). T he laser diode in the optical pick-up block may suffer electro- static break-down easily. When handling it, perform soldering bridge to the laser-tap on the flexible board. Also perform mea- sures against electrostatic break-down sufficiently before the op- eration. The flexible board is easily damaged and should be handled with care. laser-ta p OPTICAL PICK-UP FLEXIBLE BOARD SERVICE POSITION In checking the key board and main board, prepare two jigs (con- nection cable J-2502-011-1 and connection cable for F/P to main J-2502-071-1). sub board (CN801) mechanism deck main board (CNP500) servo board(CN5) key board (CN901) connect jig (connection cable for F/P to main J-2502-071-1) to the key board (CN900) and sub board (CN801). connect jig(connection cable J-2502-011-1)to the main board (CNP500) and servo board (CN5). sub panelassy SECTION 1 SERVICING NOTES NOTE FOR REPLACING THE IC600 T here are two types of IC600 on the MAIN board. In case IC600 is replaced, after surely checking which type of IC600 is mounted on the set, it exchanges according to the following procedure. In case of type1: After surely checking the type of IC600 newly mounted on the MAIN board, it replaces in the procedure according to each type. Replacing procedur to type1 1. IC600 is replaced for MN101E01KDJ (PART No. 6-804-093- 01). Replacing procedur to type2 1. IC600 is replaced for MN101E01JRD1 (PART No. 6-804-511- 02). 2. C606 is replaced for ceramic chip 15PF (PART No. 1-162- 917-11). 3. C607 is replaced for ceramic chip 12PF (PART No. 1-162- 916-11). In case of type2: Replacing procedure 1. IC600 is replaced for MN101E01JRD1 (PART No. 6-804-511- 02). Ver 1.1 – MAIN Board (Conductor Side) – IC600 C606 C607 MN101E01KDJ : TYPE1 MN101E01JRD1 : TYPE2