Sony mdx c 8900 service manual

Page 1

MDX-08900

SERVICE MANUAL us Model

E Model

Refer to RM-X4S Service Manual (9-925-
698-l1ll) issued previously for information
of remote commander (RMX4S) supplied
with this set.

Model Name Using Similar Mechanism MDX-C7900

Base Mechanism Type MG-164KS~138
Optical Pick-Up Name KMS-241A/J2N
SPECIFICATIONS

Auoto POWER SPECIFICATIONS (us Model)

POWER OUTPUT AND TOTAL HARMONIC DISTORTION

19 watts per channel minimum continuous average power into

4 ohms, 4 channels driven from 20 Hz to 20 kHz with no more than
1% total harmonic distortion.

other specifications

MD player section Ilaxmonlc distortion at 1 kHz
Signattu-noise ratio 90 till 971le
Frequency response 10 - 20,000 Hz _ 04 X! (WW)
Wow and flutter Below measurable limit Separation 35 dB I I H-
Laser Diode Impvrtics Frequency response Cit) » 15,000 Hz
Malerial GaAIAs
Wavelength 780 nm AM_
Emission Dumtlon Continuous Tuning Se 530 1,210 IHZ (US)
Laser output power Less than 44.6 W' AM tumng mtervnl:
9 kHz/10 kHz smtchable
* This output is the value measured at a distance 531 ~ 1,602 kHz
of 200 mm from the objective lens surface on the (5 9 kHz 5"?)

S30 - 1,710 kHz

0 tIca/P'tk- Bl k.
p ' "p o (athksttepHE)

. Antenna terminal External antenna connector

Tuner section Intermediate Itequency 10.71 MHz/450 kHz

FM Sensitivity 30 )IV

Tunin ran 0 87.5- 107.9 MHZ .

g g FMtuning Newts) - Continued on next page -

50 kHz/200 kHz
switchable
875 -108.0 MHZ
(at 50 kHz step)

875 ~ 107.9 MHz
(at 200 kHz step) (E)

Antenna terminal EXILYniII antenna connector
Intermediate tteqnency 10.7 MI [2
Usable sonsltivIty a dIst

Sclcdivily 75 dl} at 400 kl [7.

Signal-to-noist ratio 65 dll (stereo),
68 dB (mono)

Page 2

Power amplifier section

Outputs Speaker outputs
(sure seal connectors)

Speaker impedance 4 - 5 ohms

Maximum power output 45 W x 4 (at 4 ohms)

General

Oulpnts Linc outputs (3)
Power antenna relay
control load
Power amplifier control
load
Telephone ATI" control
load
Illumination control load
Bass 28 dB at 100 Hi.
Treble :23 dB at 10 kHz
luwcr mquimmunts 12 v DC car battery
(negative ground)
Dimensions Approx, 178 x 50 X 180 Inm
(7/5x2x7/xin.)
(w/ 11/ d)
Mounting dimensions Approx. 132 x 53 x160 mm
(7 l, x2 '/,x 6mm)

'lonr conlrols

(w/ h/d)
Moss Approx. 1.5 kg (3 lb. 4.9 oz.)
Supplied accessories Rotary commander (1)

Parts for inslallalion and
connections (1 set)
Front panel case (1)

U5. and foreign patents licensed from Dolby
laboratories Licensing Corporation.

Design and specifications are subject to change
without notice.

SAFETY-RELATED COMPONENT WARNING

COMPONENTS IDENTIFIED BY MARK A 0R DOTTED
LINE WITH MARK A ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.

NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load. etc. on clothing and the human
body.

During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.

The flexible board is easily damaged and should be handled with
care.

NOTES ON LASER DIODE EMISSION CHECK
Never look into the laser diode emission from right avove when
checking it for adustment. It is feared that you will lose your sight.

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
(KMS-241AIJ2N).

The laser diode in the optical pick-up block may suffer electro-
static break-down easily. When handling it, perform soldering
bridge to the laser~tap on the flexible board. Also perform in easures
against electrostatic break-down sufficiently before the operation.
The flexible board is easily damaged and should be handled with
care.

/
laser-tap

OPTICAL PICK-UP FLEXIBLE BOARD

Notes on chip component replacement

- Never reuse a disconnected chip component.

- Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

Flexible Circuit Board Repairing

' Keep the temperature of the soldering iron around 270 °C dur-
ing repairing.

- Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).

0 Be careful not to apply force on the conductor when soldering
or unsoldcnng.

CAUTION

Use of controls or adjustments or performance of procedures
other titan those specified herein may result in hazardous ra»
dialjon exposure.