Sony mdx c 8500 r service manual
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Extracted text from sony mdx c 8500 r service manual (Ocr-read)
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2 1. SERVICING NOTES ............................................... 3 2. GENERAL Location of Controls ....................................................... 4 Setting the Clock ............................................................. 4 Installation ....................................................................... 5 Connections ..................................................................... 7 3. DISASSEMBLY ......................................................... 11 4. ELECTRICAL ADJUSTMENTS Test Mode ........................................................................ 18 MD Section ..................................................................... 18 Tuner Section .................................................................. 18 5. DIAGRAMS 5-1. Block Diagram – SERVO Section – ............................... 19 5-2. Block Diagram – TUNER Section – .............................. 20 5-3. Block Diagram – MAIN Section – ................................. 21 5-4. Block Diagram – DISPLAY/KEY CONTROL Section – ........................ 22 5-5. Block Diagram – BUS CONTROL/POWER SUPPLY Section – ........... 23 5-6. Note for Printed Wiring Boards and Schematic Diagrams ....................................................... 24 5-7. Printed Wiring Boards – SERVO Board (Component Side)/ SENSOR Board – ............................................................ 26 5-8. Printed Wiring Board – SERVO Board (Conductor Side) – .............................. 27 5-9. Schematic Diagram – SERVO Board (1/2)/ SENSOR Board– ...................... 28 5-10. Schematic Diagram – SERVO Board (2/2) – ................. 29 5-11. Printed Wiring Board – MAIN Board (Component Side) – .............................. 30 5-12. Printed Wiring Board – MAIN Board (Conductor Side) – ................................ 31 5-13. Schematic Diagram – MAIN Board (1/4) – ................... 32 5-14. Schematic Diagram – MAIN Board (2/4) – ................... 33 5-15. Schematic Diagram – MAIN Board (3/4) – ................... 34 5-16. Schematic Diagram – MAIN Board (4/4) – ................... 35 5-17. Printed Wiring Board – DSO Board – ............................ 36 5-18. Schematic Diagram – DSO Board – ............................... 37 5-19. Printed Wiring Board – SUB Board – ............................ 38 5-20. Schematic Diagram – SUB Board – ............................... 39 5-21. Printed Wiring Board – KEY Board – ............................ 40 5.22. Schematic Diagram – KEY Board – .............................. 41 5-23. IC Pin Function Description ........................................... 47 6. EXPLODED VIEWS ................................................ 59 7. ELECTRICAL PARTS LIST ............................... 63 TABLE OF CONTENTS General Outputs Audio outputs Power antenna relay control lead Power amplifier control lead Telephone ATT control lead Power requirements 12 V DC car battery (negative ground) Dimensions Approx. 178 × 50 × 183 mm (7 1/8 × 2 × 7 1/8 in.) (w/h/d) Mounting dimensions Approx. 182 × 53 × 162 mm (7 1/4 × 2 1/8 × 6 3/8 in.) (w/h/d) Mass Approx. 1.2 kg (2 lb 10 oz) Supplied accessories Card remote commander RM-X91 (MDX-C8500X) Parts for installation and connections (1 set) Front panel case (1) U.S. and foreign patents licensed from Dolby laboratories Licensing Corporation. Design and specifications are subject to change without notice.
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3 SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY. SECTION 1 SERVICING NOTES - Model Identification There are three types of main board in according of destination for MDX-C8500R. – MAIN BOARD (Component Side) Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270 ˚C dur- ing repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. The laser diode in the optical pick-up block may suffer electro- static break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK Never look into the laser diode emission from right avove when checking it for adustment. It is feared that you will lose your sight. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK (KMS-241C/J1NP) The laser diode in the optical pick-up block may suffer electro- static break-down easily. When handling it, perform soldering bridge to the laser-tap on the flexible board. Also perform m easures against electrostatic break-down sufficiently before the operation. The flexible board is easily damaged and should be handled with care. laser-tap OPTICAL PICK-UP FLEXIBLE BOARD R502 R503 IC502 R502 R503 TYPE Aa× TYPE B×a TYPE Caa Type A, B and C can be identified by its model number label at the buttom of the set. – SPECIFICATION LABEL – TYPE A TYPE B TYPE C