Sony mdx c 800 rec service manual
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Extracted text from sony mdx c 800 rec service manual (Ocr-read)
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2 over write hea d SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. SERVICE NOTE CAUTION Use of controls or adjustments or performance of proce- dures other than those specified herein may result in haz- ardous radiation exposure. Notes on Chip Component Replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be dam- aged by heat. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, ob- serve from more than 30 cm away from the objective lens. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK (KMS-263A) The laser diode in the optical pick-up block may suffer electrostatic break-down easily. When handling it, perform soldering bridge to the laser-tap on the flexible board. Also perform measures against electrostatic break-down sufficiently before the operation. The flex- ible board is easily damaged and should be handled with care.HANDLING PRECAUTION FOR THE OVER WRITE HEAD The over write head is susceptible to damage. When adjusting and checking the over write head, it requires careful handling. ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ!! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY. pick-upflexible board laser-tap variable resistor Never turn this variable resistor.
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3 1. GENERAL Location of controls ................................................................. 4 Getting Started ......................................................................... 4 Setting the clock ...................................................................... 4 MD player CD/MD unit .......................................................... 5 Recording on an MD ............................................................... 6 Editing an MD ......................................................................... 8 Radio ....................................................................................... 9 Other Functions ..................................................................... 10 TV/Video ............................................................................... 11 Connections ........................................................................... 13 2. DISASSEMBLY 2-1. Sub Panel Assy .................................................................. 16 2-2. MD Mechanism Block ...................................................... 16 2-3. Main Board, Digital Board ................................................ 17 2-4. Heat Sink (REC) ............................................................... 17 2-5. MD Mechanism ................................................................. 18 2-6. Computer Board ................................................................ 18 2-7. Servo Board ....................................................................... 19 2-8. Tension Spring (B) ............................................................ 19 2-9. Chassis (L), (R) Assy ........................................................ 20 2-10. Loading Motor Assy .......................................................... 20 2-11. Sled Motor Assy ................................................................ 21 2-12. Sensor Board ..................................................................... 21 2-13. Spindle Motor Assy ........................................................... 22 2-14. Over Write Head ............................................................... 22 2-15. Optical Pick-up ................................................................. 23 3. DIAGRAMS 3-1. IC Pin Descriptions ........................................................... 24 3-2. Block Diagram –MD Section– .......................................... 30 3-3. Block Diagram –Tuner Section– ....................................... 31 3-4. Block Diagram –Display Section– .................................... 32 3-5. Circuit Boards Location .................................................... 33 3-6. Printed Wiring Board –Servo Section– ............................. 34 3-7. Schematic Diagram –Servo Section (1/3)– ....................... 36 3-8. Schematic Diagram –Servo Section (2/3)– ....................... 37 3-9. Schematic Diagram –Servo Section (3/3)– ....................... 38 3-10. Printed Wiring Board –Sensor Section– ........................... 39 3-11. Schematic Diagram –Sensor Section– .............................. 39 3-12. Printed Wiring Board –Computer Section– ...................... 40 3-13. Schematic Diagram –Computer Section– ......................... 41 3-14. Printed Wiring Boards –Main Section– ............................ 42 3-15. Schematic Diagram –Main Section (1/4)– ........................ 44 3-16. Schematic Diagram –Main Section (2/4)– ........................ 45 3-17. Schematic Diagram –Main Section (3/4)– ........................ 46 3-18. Schematic Diagram –Main Section (4/4)– ........................ 47 3-19. Printed Wiring Board –Relay Section– ............................. 48 3-20. Schematic Diagram –Relay Section– ................................ 49 3-21. Printed Wiring Board –Key Section– ................................ 50 3-22. Schematic Diagram –Key Section– ................................... 51 4. EXPLODED VIEWS 4-1. Sub Panel Section .............................................................. 57 4-2. Front Panel Section ........................................................... 58 4-3. Chassis Section ................................................................. 59 4-4. MD Mechanism Section (1) .............................................. 60 4-5. MD Mechanism Section (2) .............................................. 61 4-6. MD Mechanism Section (3) .............................................. 62 5. ELECTRICAL PARTS LIST ........................................ 63 TABLE OF CONTENTS