Sony mdx c 670 service manual

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sony mdx c 670 service manual

Extracted text from sony mdx c 670 service manual (Ocr-read)


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Ð 2 Ð TABLE OF CONTENTS 1. SERVICE NOTE ......................................................... 2 2. GENERAL ..................................................................... 3 3. DISASSEMBLY ............................................................ 7 4. ELECTRICAL ADJUSTMENTS ........................... 12 5. DIAGRAMS 5-1. Printed Wiring Boards ÐMD SectionÐ .............................. 15 5-2. Schematic Diagram ÐMD SectionÐ .................................. 17 5-3. Schematic Diagram ÐMAIN SectionÐ .............................. 22 5-4. Printed Wiring Board ÐMAIN SectionÐ ........................... 27 5-5. Printed Wiring Board ÐDISPLAY SectionÐ ..................... 31 5-6. Schematic Diagram ÐDISPLAY SectionÐ ........................ 33 6. EXPLODED VIEWS .................................................. 35 7. ELECTRICAL PARTS LIST .................................. 39 General Output Line out (2) Power antenna relay control lead Power amplisier control lead Telephone mute control lead (MDX-C670) Illumination control lead Tone controls Bass ± 10 dB at 100 Hz Treble ± 10 dB at 10 kHz Power requirements 12 V DC car battery (negative ground) Dimensions Approx. 188 ´ 58 ´ 174 mm (w/h/d) Mounting dimensions Approx. 178 ´ 50 ´ 162 mm (w/h/d) Mass Approx. 1.1 kg Supplied accessories Rotary remote (1) Parts for installation and connections (1 set) Front panel case (1) U.S. and foreign patents liscensed from Dolby laboratories Licensing Cor- poration. Design and specifications are subject to change without notice. CAUTION Use of controls or adjustments or performance of pro- cedures other than those specified herein may result in hazardous radiation exposure. Flexible Circuit Board Repairing ·Keep the temperature of the soldering iron around 270 ûC during repairing. ·Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). ·Be careful not to apply force on the conductor when solder- ing or unsoldering. Notes on chip component replacement ·Never reuse a disconnected chip component. ·Notice that the minus side of a tantalum capacitor may be damaged by heat. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. ATTENTION AU COMPOSANT AYANT RAPPORT Ë LA SƒCURITƒ! LES COMPOSANTS IDENTIFIƒS PAR UNE MARQUE ! SUR LES DIAGRAMMES SCHƒMATIQUES ET LA LISTE DES PIéCES SONT CRITIQUES POUR LA SƒCURITƒ DE FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS QUE PAR DES PIéCES SONY DONT LES NUMƒROS SONT DONNƒS DANS CE MANUEL OU DANS LES SUPPLƒMENTS PUBLIƒS PAR SONY. SECTION 1 SERVICE NOTE ·Note on replacing the MAIN board (German model) As the repair parts of MAIN board with mounted parts destined for German model, the MAIN board with mounted parts for AEP model is supplied. Accordingly, when replacing the board, exchange two following parts. R61 12k n 4.7k (1-216-065-00) R71 12k n 4.7k (1-216-065-00) [MAIN BOARD] (Conductor Side) R71 R61 IC751