Sony mdx 66 xlp service manual
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Extracted text from sony mdx 66 xlp service manual (Ocr-read)
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2 MDX-66XLP TABLE OF CONTENTS 1. SERVICE NOTE 1-1. To Place the Set into Playback Mode .................................. 3 1-2. How to Check the Servo Board Waveforms ........................ 3 2. GENERAL Preparations (US, Canadian Model) ........................................ 4 Connections (US, Canadian Model) ........................................ 4 Preparations (AEP, UK Model) ............................................... 5 Connections (AEP, UK Model) ............................................... 5 3. DISASSEMBLY 3-1. Panel (Rear) Assy ................................................................ 6 3-2. Case (Upper) ....................................................................... 7 3-3. Panel (Front) Assy ............................................................... 7 3-4. MD Block ........................................................................\ .... 8 3-5. Main Board ........................................................................\ . 8 3-6. Chassis (OP) Block ............................................................. 9 3-7. Servo Board ........................................................................\ . 9 3-8. Optical Pick-up ................................................................. 10 3-9. Note on Assembly for the Chassis (OP) Block ................. 11 4. DIAGRAMS 4-1. IC Pin Descriptions ........................................................... 12 4-2. Block Diagram .................................................................. 18 4-3. Circuit Boards Location .................................................... 19 4-4. Printed Wiring Boards –Servo Section– ............................ 20 4-5. Schematic Diagram –Servo Section– ................................ 22 4-6. Schematic Diagram –Main Section– ................................. 23 4-7. Printed Wiring Boards –Main Section– ............................ 24 4-8. Printed Wiring Board –Power Section– ............................ 26 4-9. Schematic Diagram –Power Section– ............................... 27 5. EXPLODED VIEWS 5-1. Case Section ...................................................................... 30 5-2. Main Board Section .......................................................... 31 5-3. MD Section (1) .................................................................. 32 5-4. MD Section (2) .................................................................. 33 5-5. MD Section (3) .................................................................. 34 6. ELECTRICAL PARTS LIST ........................................ 35 SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PA RT NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ!! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY. SERVICE NOTE CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. laser-tap OPTICAL PICK-UP FLEXIBLE BOARD Notes on Chip Component Replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT T he laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, ob- serve from more than 30 cm away from the objective lens. NOTES ON PICK-UP FLEXIBLE BOARD T he pick-up flexible board in this set is secured to the optical pick- up with an adhesive tape. Once the tape is removed, an adhering force becomes weak, and it cannot be reused. Therefore, if the optical pick-up is replaced, replace also the pick- up flexible board with a new one. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK (KMS-241C/J1N) T he laser diode in the optical pick-up block may suffer electrostatic break-down easily. When handling it, perform soldering bridge to the laser-tap on the flexible board. Also perform measures against electrostatic break-down sufficiently before the operation. The flexible board is easily damaged and should be handled with care. CLASS PRODUCT LASER 1 This label is located on the bottom of the chassis. AEP, UK model US, Canadian model V er 1.1
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3 MDX-66XLP 1-1. TO PLACE THE SET INTO PLAYBACK MODE The this set has no key control function and cannot be placed into the Playback mode alone. For key control, the this set is controlled through serial communication with a master unit (car audio player, TV tuner or source selector compatible with the Sony BUS system.) To service the this set, the set should be connected as given below: SECTION 1 SERVICE NOTE 1-2. HOW TO CHECK THE SERVO BOARD WAVEFORMS 1. Remove the panel (rear) assy, case (upper) and panel (front) assy.Then, remove the main board from the mechanism deck. (See page 8 of SECTION 3. DISASSEMBLY.) 2. Remove the chassis (OP) block from the mechanism deck. (See pag e 9 of SECTION 3. DISASSEMB LY.) 3. Short each bridge points BP1 and BP2 on the main board by solder bridge. 4. Connect the power board with the main board by the main flexible board. Connect the main board with the servo board by the servo flexible board. 5. Connect to a master unit. With the master unit OFF, press the preset buttons 4 t 5 t 1 (2 seconds or more each) in this turn to enter the TEST mode. 6. Open the doors and insert a disc in the chassis (OP) assy. Use the SOURCE button on the master unit to select to MD to playback. 7. Check the waveforms at each point on the servo board. Note: After this check is completed, remove solder between shorted bridge points BP1 and BP2 and open these points. MDX-66XLP Master unit BUS CONTROL IN BUS CONTROL OUT BP1 BP2 – main board (conductor side) –