Sony mds 303 md service manual

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MUS-303

SERVICE MANUAL AEP Model

UK Model

Model Name Using Similar Mechanism MOS-302
Mechanism Type MDM-2A
Base Unit Type MBU-2
Optical Pick-up Block Type KMS-21OA/J-N
SPECIFICATIONS
MD deck section DIGIIAL IN Square Optical
optical wave
System MiniDisc digital audio system connector lenghtli - '.
Dist MiniDisc iack 660 nm
Laser Semiconductor laser 0:780 nm)
Emission duration: Continuous Outputs
Laser output power Less than 44.6 uW' .
This output is the value measured at a Jack Rated up! Load Impedance
distance of 200 mm from the objective type
lens surface on the optical pick-up moms Stereo 1ovmw 32 ohms
block with 7 mm aperture. phone
laser diode properties Material: GaAlAs jack
WWW" (CW) 40 rPm ° 900 'P' LINE Phone 2 Vrms Over 10 kilohms
Error correction Advanced Cross interleave Reed (ANALOG) jacks (at 50 kil ohms)
_ Solomon Code (ACIRC) om-
Sampling frequenzy 44.1 kHz
Modulation system EFM (Eight-thourteen Modulation) DIGITAL Square ~18 dBm Wave length: 660 nm
Number of channels 2 stereo channels OUT optical
Ftequency response 5 to 20,000 Hz 205 dB my
Signal-tn-noisa ratio Over 96 dB jack
(during p|ayback)
Wow and flutter Below measurable limit
Inputs
Jack type Input Rated Input Minimum
impedance input
- Continued on next page -
LlNE Phonu jads 47 kilohms 500 mes 125 mes

(ANALOG) m MINIDISC DECK
ONY;

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G eneral

Power requirements

Where purchased Power requirements

AEP 220 ~ 230 V AC, 50/60 Hz
UK 220» 240VAC, 50/60 Hz
Power consumption 20 W

Dimensions (approx) (wlhld) ind. projecting parts

UK mode]: 430 x 97.5 x 303 mm
AEP model 430 x 97.5 x 292 mm
(17x3 7/a X 11 /z in.)

Mass (approx) 3.6 kg (7 lbs 15 oz)

Supplied accessories

0 Audio connecting cords (2)

0 Optical cable (1)

0 Remote commander (remote) (1)
RM-D4M

0 Sony SUM-3 (NS) batteries (2)

US. and foreign patents licensed from Dolby Laboratories
Licensing Corporation

Design and specifications are subject to change without
notice.

TABLE OF CONTENTS
Section mLe Bags
SECTION 1. GENERAL 4

SECTION 2. DISASSEMBLY
24. Case
2-2. Front Panel Assembly
2-3. Mechanism Deck .
2-4. Slider Assembly
2-5. Base Unit and Loading Motor Assembly
2-6. Slider Assembly Mounting ....................

SECTION 3. TEST MODE
31 . Setting the Test Mode
3-2. Exiting the Test Mode
3-3. Basic Operations of the Test Mode
3-4. Selecting the Test Mode .............
3-4-1. Operating the Continuous Playback Mode
3-4-2. Operating the Continuous Recording Mode
3-4-3. Non-Volatile Memory Mode
3-5. Functions of Other keys
3»6. Test Mode Displays
3-7. Meanings of Other Displays
3-8. Precautions for Use of Test Mode .

SECTION 4 ELECTRICAL ADJUSTMENTS
4-1. Precautions for Checking Laser Diode Emission .
4-2. Precautions for Use of optical pickup (KMS-21OA).
4'3. Precautions for Adjustments .............
4-4. Creating MO Continuously Recorded Disc.
4-5r Temperature Compensatlon Offset Adjustment
4-6. Laser Power Adjustment
4-7. Traverse Adjustment
4-8. Focus Bias Adjustment
4-9. Error Rate Check .....
4-9-1. CD Error Rate Check
4-92. M0 Error Rate Check
440. Focus Bias Check ..........
4-1 1. Adjusting Points and Connecting Points

SECTION 5. DIAGRAMS
54. Circuit Boards Location
5-2. Block Diagram .........
5-3. Printed Wiring Boards - RF Section -
5-4. Schematic Diagram - FlF Section - ..
5-5. Schematic Diagram - Digital Section -
545. Printed Wiring Boards - Digital Sectlon -
5-7. Schematic Diagram - Display/Power Section
5~8. Printed Wiring Boards - Display/Power Section --
5-9. IC Pin Functions
~ |Clo1 FlF AMP (CXA1981R) ......................................... 58
o IC121 Digital Signal Processor,
Digital Servo Signal Processor, EFM/ACIFlC Encoder/
Decoder (CXDZSSSAR)
. I020? System Controller (M37610MD~052FP)
~ |0271 Shock-Proof Memory controller,
ATRAC Encoder/ Decoder (CXD2536R) ...................... 65

SECTION 6. EXPLODED VIEWS
6-1. Case and Front Panel Sectio
6-2. Chassis Section ...................
6-ar Mechanism Section (MOM-2A
6-4. Base Unit Section (MBU-2)

SECTION 7. ELECTRICAL PARTS LIST .................... 72

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