Sony mce f 808 k service manual

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sony mce f 808 k service manual

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Page 1

2 This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. The following caution label is located inside the unit. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Notes on chip component replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing -Keep the temperature of soldering iron around 270˚C during repairing. -Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). -Be careful not to apply force on the conductor when soldering or unsoldering. MCE-F808K SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repain parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. The emission check enables continuous checking of the S curve. LASER DIODE AND FOCUS SEARCH OPERATION CHECK Carry out the S curve check in CD section adjustment and check that the S curve waveform is output three times. TABLE OF CONTENTS 1. SERVICING NOTE····················································· 3 2. GENERAL··································································· 4 3. DISASSEMBLY·························································· 5 3-1. Top Cabinet ··································································· 6 3-2. VCD Door, Front Panel Section ··································· 6 3-3. CD Mechanism Deck (DECK ASSY) ·························· 7 3-4. MAIN Board, TOTAL Board ········································ 7 3-5. FRONT Board, C/SKD Board ······································ 8 3-6. Disk Tray ······································································ 8 3-7. Loading Belt, CD Pwb Assy (Loading) ························ 9 3-8. Pick-Up Assy ································································ 9 4. TROUBLESHOOTING ················································· 10 4-1. CD Section ·································································· 10 4-2. MPEG Part Troubleshooting ······································· 15 5. DIAGRAMS ······································································ 29 5-1. Circuit Boards Location ·············································· 29 5-2. Block Diagrams – BD Section – ···························································· 30 – MPEG Section – ······················································ 31 – MAIN Section – ······················································· 32 5-3. Printed Wiring Board – MAIN/PANEL Section – ······ 33 5-4. Schematic Diagram – MAIN/PANEL Section – ········ 34 5-5. Printed Wiring Board – TOTAL Section – ················· 35 5-6. Schematic Diagram – TOTAL Section – ···················· 36 5-7. IC Block Diagrams ····················································· 37 5-8. IC Pin Functions ························································· 39 6. EXPLODED VIEWS ······················································ 44 6-1. Cabinet and MAIN FRAME Section ·························· 44 6-2. CD Mechanism Section ·············································· 45 7. ELECTRICAL PARTS LIST ······································· 46