Sony icf f 1 service manual
This is the 10 pages manual for sony icf f 1 service manual.
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Extracted text from sony icf f 1 service manual (Ocr-read)
Page 1
- 2 - Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing - Keep the temperature of soldering iron around 270˚C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. SECTION 1 GENERAL This section is extracted from instruction manual.
Page 2
- 3 - SECTION 2 DISASSEMBLY Note :Disassemble the unit in the order as shown below. Cabinet (rear) assy Set Chassis assy Speaker (SP1) Vol board Main board Note :Follow the disassembly procedure in the numerical order given. 2-1. CABINET (REAR) ASSY 5 4 Four screws (+BTP 3 × 12) 3 Two screws (+BTP 3 × 12) 1 Push the knob (Battery box). 2 Box, batter y Cabinet (rear) assy 9 8 Two screws (+P 2.6 × 8) 7 Remove solderings Chassis assy 5 Knob (vol) 1 Knob (tune) 2 O ring (DIA 12.5) 6 O ring (vol) 4 E ring 3 Spring, ring 3 Speaker (10 cm)(SP1) Claw Two claws 1 Spring, SP detent2 2-2. CHASSIS ASSY 2-3. SPEAKER (SP1)