Sony icd r 100 pc service manual

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sony icd r 100 pc service manual

Extracted text from sony icd r 100 pc service manual (Ocr-read)


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Ð 2 Ð Specifications ........................................................................... 1 1. SERVICING NOTE ....................................................... 2 2. GENERAL ....................................................................... 3 3. DISASSEMBLY 3-1. Lid ASSY, Upper ........................................................ 5 3-2. Digital Board .............................................................. 5 3-3. Unit, Switch ................................................................ 6 3-4. Jack Board .................................................................. 6 3-5. Main Board ................................................................. 6 4. DIAGRAMS 4-1. Explanation of IC Terminals ....................................... 7 4-2. Block Diagrams .......................................................... 9 4-3. Printed Wiring Boards (Main Section) ...................... 11 4-4. Schematic Diagram (Main Section) ......................... 13 4-5. Printed Wiring Boards (Digital Section) .................. 17 4-6. Schematic Diagram (Digital Section) ....................... 18 5. EXPLODED VIEWS 5-1. Case Section ............................................................. 23 5-2. Main Board Section .................................................. 24 6. ELECTRICAL PARTS LIST .................................... 25 Flexible Circuit Board Repairing ¥ Keep the temperature of the soldering iron around 270¡C during repairing. ¥ Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). ¥ Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement ¥ Never reuse a disconnected chip component. ¥ Notice that the minus side of a tantalum capacitor may be dam- aged by heat. TABLE OF CONTENTS Jig (J-2503-010-A) Main boar d Digital board SECTION 1 SERVICING NOTE Using the special connector jig (J-2503-101-A) to connect the main board and digital board will prove convenient when servicing the unit with power applied. Note : Do not apply excessive amounts of flux during replace- ment of electronic components since this may cause elec- trical shorts due to moisture. Wipe off flux after electronic components exchange. CAUTION ON REPLACING FLASH MEMORY The BAD-BLOCK check* must be executed, when the flash memory (IC701) in this set was replaced. The set will not operation normally, unless this check is finished. * The BAD-BLOCK check detects an area (bad-block) in the flash memory where data validity cannot be guaranteed, and saves this information in the TOC-AREA so that a bad-block is not used. BAD-BLOCK check procedure : 1. Apply 3V from regulated power supply to the battery terminals. 2. Once the power is supplied, the check starts and then proceeds for approx. 3 minutes. (Be sure to keep applying the power during the check) 3. When the check completes, the result is shown as bellows. OK : Only the LCD back light LED (D503, 504) turns on. NG : Red LED blinks or turns on or green LED turns on in the OPR LED (D502), 4. In case of OK, press the STOP button. Note : ¥ In case of NG, check system control IC (IC704), flash memory IC (IC701) and the peripheral circuit. (Particularly, check care- fully the soldering of the flash memory) ¥ After finishing the BAD-BLOCK check, assemble the set, load the dry battery, and confirm if the set operates normally.

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Ð 3 Ð SECTION 2 GENERAL LOCATION AND FUNCTION OF CONTROLS This section is extracted from instruction manual.