Sony htcvx 500 service manual
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2 CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Notes on chip component replacement ¥ Never reuse a disconnected chip component. ¥ Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing ¥ Keep the temperature of soldering iron around 270ûC during repairing. ¥ Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). ¥ Be careful not to apply force on the conductor when soldering or unsoldering. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. LASER DIODE AND FOCUS SEARCH OPERATION CHECK Carry out the ÒS curve checkÓ in ÒCD section adjustmentÓ and check that the S curve waveform is output three times. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
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3 TABLE OF CONTENTS 1. SERVICING NOTE ááááááááááááááááááááááááááááááááááááááááááááááááááá\ áá 4 2. GENERAL ááááááááááááááááááááááááááááááááááááááááááááááááááá\ áááááááááááááááááá 7 3. DISASSEMBLY 3-1. Loading Panel ááááááááááááááááááááááááááááááááááááááááááááááááááá\ áááááááááááááááááá 8 3-2. Back Panel and CD Mechanism Deck ááááááááááááááááááááááááááááááá 8 3-3. Front Panel ááááááááááááááááááááááááááááááááááááááááááááááááááá\ áááááááááááááááááááááá 9 3-4. TC Mechanism Deck and Cassette Holder ááááááááááááááááááááááááá 9 3-5. Disk Tray ááááááááááááááááááááááááááááááááááááááááááááááááááá\ áááááááááááááááááááááá 10 4. MECHANICAL ADJUSTMENTS áááááááááááááááááááááááááá 11 5. ELECTRICAL ADJUSTMENTS ááááááááááááááááááááááááááá 11 6. DIAGRAMS 6-1. Circuit Boards Location ááááááááááááááááááááááááááááááááááááááááááááááááááá\ 15 6-2. Block Diagrams ¥ Servo Section ááááááááááááááááááááááááááááááááááááááááááááááááááá\ áááááááááááááá 16 ¥ Audio/Video CD Section áááááááááááááááááááááááááááááááááááááááááááááááá 17 ¥ Tape Deck Section ááááááááááááááááááááááááááááááááááááááááááááááááááá\ ááááááá 18 ¥ Power Section ááááááááááááááááááááááááááááááááááááááááááááááááááá\ ááááááááááááá 19 6-3. Printed Wiring Board CD Section áááááááááááááááááááááááááááááááááá 20 6-4. Schematic Diagram CD Section ááááááááááááááááááááááááááááááááááááá 21 6-5. Schematic Diagram Deck Section áááááááááááááááááááááááááááááááááá 22 6-6. Printed Wiring Board Deck Section ááááááááááááááááááááááááááááááá 23 6-7. Printed Wiring Board Main Section ááááááááááááááááááááááááááááááá 24 6-8. Schematic Diagram Main (1/2) Section ááááááááááááááááááááááááá 25 6-9. Schematic Diagram Main (2/2) Section ááááááááááááááááááááááááá 26 6-10. Printed Wiring Board Leaf SW Section ááááááááááááááááááááááááá 27 6-11. Schematic Diagram Leaf SW Section áááááááááááááááááááááááááááá 27 6-12. Printed Wiring Board Panel Section ááááááááááááááááááááááááááááááá 28 6-13. Schematic Diagram Panel Section ááááááááááááááááááááááááááááááááá 29 6-14. Schematic Diagram CD Motor Section áááááááááááááááááááááááááá 30 6-15. Printed Wiring Board CD Motor Section ááááááááááááááááááááááá 31 6-16. Printed Wiring Board Video Section áááááááááááááááááááááááááááááá 32 6-17. Schematic Diagram Video (1/2) Section áááááááááááááááááááááááá 33 6-18. Schematic Diagram Video (2/2) Section áááááááááááááááááááááááá 34 6-19. IC Block Diagrams ááááááááááááááááááááááááááááááááááááááááááááááááááá\ áááááááá 38 6-20. IC Pin Function Description ááááááááááááááááááááááááááááááááááááááááááááá 40 7. EXPLODED VIEWS 7-1. Case and Back Panel Section ááááááááááááááááááááááááááááááááááááááááááá 47 7-2. Front Panel Section ááááááááááááááááááááááááááááááááááááááááááááááááááá\ ááááááá 48 7-3. CD Mechanism Section 1 (CDM38-5BD24) ááááááááááááááááááá 49 7-4. CD Mechanism Section 2 (CDM38-5BD24) ááááááááááááááááááá 50 7-5. Base Unit Section (BU-5BD24) ááááááááááááááááááááááááááááááááááááááá 51 7-6. TC Mechanism Section 1 (TCM-230AWR2/230PWR2) á 52 7-7. TC Mechanism Section 2 (TCM-230AWR2/230PWR2) á 53 8. ELECTRICAL PARTS LIST ááááááááááááááááááááááááááááááááááá 54