Sony hcd xb 33k hcd xb 44k
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CD player section System Compact disc and digital audio system Laser Semiconductor laser (l = 780nm). Emission duration: continuous Laser output Max. 44.6µW* *This output is the value measured at a distance of 200 mm from the objective lens surface on the Optical Pick-up Block with 7 mm aperture. Wavelength 780 Ð 790 nm Frequency response 2 Hz Ð 20 kHz (±0.5 dB) Signal-to-noise ratio More than 90 dB Dynamic range More than 90 dB CD DIGITAL OUT (square optical connector jack, rear panel) Wave length: 600 nm Output level: Ð 18 dBm Tape player section Recording system 4-track 2-channel stereo Frequency response (DOLBY NR OFF) 60 Ð 13,000 Hz (±3 dB), using a Sony TYPE I cassette 60 Ð 14,000 Hz (±3 dB), using a Sony TYPE II cassette Tuner section FM stereo, FM/AM superheterodyne tuner FM tuner sectionTuning range (2 band model) Antenna FM wire antenna Antenna terminals 75 ohm unbalanced Intermediate frequency 10.7 MHz AM tuner sectionTuning range 531 Ð 1,602 kHz (with the tuning interval set at 9 kHz) 530 Ð 1,710 KHz (with the tuning interval set at 10 kHz) Antenna AM loop antenna, External antenna terminals Intermediate frequency 450 kHz General Power requirements Other models: 110 Ð 120 V or 220 Ð 240 V AC, 50/60 Hz Adjustable with voltage selector Power consumption (HCD-XB33K): 240 watts (HCD-XB44K): 250 watts Dimensions (w/h/d) Approx. 355 x 425 x 435 mm (14 x 16 3/4 x 17 1/4 in) incl. projecting parts and controls Mass Approx. 14.0 kg (30 lb 14 oz.) Supplied accessories: AM loop antenna (1) Remote RM-SD70S (1) Size AA (R6) batteries (2) FM wire antenna (1) Speaker cords* (HCD-XB44K) (2) Design and specifications are subject to chang e without notice. Ñ 2 Ñ This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. The following caution label is located inside the unit. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Notes on chip component replacement ¥ Never reuse a disconnected chip component. ¥ Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing ¥ Keep the temperature of soldering iron around 270ûC during repairing. ¥ Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). ¥ Be careful not to apply force on the conductor when soldering or unsoldering. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
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Ñ 3 Ñ TABLE OF CONTENTS 1. GENERAL Ð FRONT PANEL Ð ááááááááááááááááááááááááááááááááááááááááááááááááááá\ ááááááááá 5 Ð BACK PANEL Ð ááááááááááááááááááááááááááááááááááááááááááááááááááá\ ááááááááááá 6 2. DISASSEMBLY ááááááááááááááááááááááááááááááááááááááááááááááááááá\ áááááááááá 10 3. TEST MODE ááááááááááááááááááááááááááááááááááááááááááááááááááá\ áááááááááááááááá 18 4. MECHANICAL ADJUSTMENTS áááááááááááááááááááááááááááá 20 5. ELECTRICAL ADJUSTMENTS DECK Section ááááááááááááááááááááááááááááááááááááááááááááááááááá\ áááááááááááááá 20 CD Section ááááááááááááááááááááááááááááááááááááááááááááááááááá\ áááááááááááááááááááá 23 6. DIAGRAMS 6-1. Circuit Board Location ááááááááááááááááááááááááááááááááááááááááááááááááááá\ á 25 6-2. Block Diagrams Ð CD/Key Control Section Ð áááááááááááááááááááááááááááááááááááááááááááá 26 Ð Main Section Ð ááááááááááááááááááááááááááááááááááááááááááááááááááá\ ááááááááááá 27 6-3. Printed Wiring Board Ð BD Section Ð ááááááááááááááááááááááááááááá 31 6-4 Schematic Diagram Ð BD Section Ð áááááááááááááááááááááááááááááááá 33 6-5. Printed Wiring Board Ð CD Motor Section Ð ááááááááááááááááá 35 6-6. Schematic Diagram Ð CD Motor Section Ð áááááááááááááááááááá 37 6-7. Printed Wiring Board Ð Deck Section Ð ááááááááááááááááááááááááá 39 6-8. Schematic Diagram Ð Deck Section Ð áááááááááááááááááááááááááááá 41 6-9. Schematic Diagram Ð Switch Section Ð áááááááááááááááááááááááááá 43 6-10. Printed Wiring Board Ð Switch Section Ð ááááááááááááááááááááááá 45 6-11. Printed Wiring Board Ð Headphone-Mic Section Ð áááááááá 46 6-12. Schematic Diagram Ð Headphone-Mic Section Ð ááááááááááá 47 6-13. Printed Wiring Board Ð Panel Section Ð ááááááááááááááááááááááááá 49 6-14. Schematic Diagram Ð Panel Section Ð ááááááááááááááááááááááááááááá 51 6-15. Printed Wiring Board Ð Power Section Ð ááááááááááááááááááááááááá 53 6-16. Schematic Diagram Ð Power Section Ð ááááááááááááááááááááááááááá 55 6-17. Printed Wiring Board Ð Main Section Ð ááááááááááááááááááááááááá 57 6-18. Schematic Diagram Ð Main Section (1/5) Ð áááááááááááááááááááá 59 6-19. Schematic Diagram Ð Main Section (2/5) Ð áááááááááááááááááááá 61 6-20. Schematic Diagram Ð Main Section (3/5) Ð áááááááááááááááááááá 63 6-21. Schematic Diagram Ð Main Section (4/5) Ð áááááááááááááááááááá 65 6-22. Schematic Diagram Ð Main Section (5/5) Ð áááááááááááááááááááá 67 6-23. Schematic Diagram Ð Key Control Section Ð áááááááááááááááááá 69 6-24. Printed Wiring Board Ð Key Control Section Ð ááááááááááááááá 69 6-25. IC Block Diagrams ááááááááááááááááááááááááááááááááááááááááááááááááááá\ ááááááá 71 6-26. IC Pin Function Description áááááááááááááááááááááááááááááááááááááááááááá 76 7. EXPLODED VIEWS ááááááááááááááááááááááááááááááááááááááááááááááááááá\ áá 79 8. ELECTRICAL PARTS LIST áááááááááááááááááááááááááááááááááááááá 88