Sony hcd vx 90av
This is the 88 pages manual for sony hcd vx 90av.
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Ð 2 Ð 4-215-642-1¹EA, MY, SP model 4-215-642-3¹IA model 4-215-642-4¹E model 4-215-642-5¹TH model MODEL IDENTIFICATION Ñ BACK PANEL Ñ ¥ Abbreviation SP : Singapore model MY : Malaysia model IA : Indonesia model TH : Thai model EA : Saudi arabia model CAUTIONUse of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. Notes on chip component replacement ¥ Never reuse a disconnected chip component. ¥ Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing ¥ Keep the temperature of soldering iron around 270ûC during repairing. ¥ Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). ¥ Be careful not to apply force on the conductor when soldering or unsoldering. SAFETY-RELATED COMPONENT WARNING !! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PROD- UCT MARKING is located on the rear exterior. Parts No. PARTS No. MODEL
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Ð 3 Ð TABLE OF CONTENTS 1. SERVICING NOTE .......................................................... 4 2. GENERAL .......................................................................... 7 3. DISASSEMBLY 3-1. Loading Panel ....................................................................... 9 3-2. Front Panel ............................................................................ 9 3-3. Cassette Lid and Tape Mechanism ...................................... 10 3-4. CD SW Board and Panel Board .......................................... 10 3-5. Disc Tray ............................................................................. 11 4. TEST MODE ..................................................................... 12 5. MECHANICAL ADJUSTMENTS.......................... 13 6. ELECTRICAL ADJUSTMENTS ............................... 13 7. DIAGRAMS 7-1. Circuit Boards Location ...................................................... 18 7-2. Block Diagrams ¥ CD Section ....................................................................... 19 ¥ Video Section ................................................................... 21 ¥ Deck Section .................................................................... 23 ¥ Main Section .................................................................... 25 ¥ Power Section .................................................................. 27 ¥ Display Section ................................................................ 29 7-3. Printed Wiring Board Ð BD Section Ð ................................. 33 7-4. Schematic Diagram Ð BD Section Ð ................................... 35 7-5. Schematic Diagram Ð Deck Section Ð ................................ 37 7-6. Printed Wiring Board Ð Deck Section Ð .............................. 39 7-7. Printed Wiring Board Ð Video Section Ð ............................. 41 7-8. Schematic Diagram Ð Video (1/3) Section Ð ....................... 43 7-9. Schematic Diagram Ð Video (2/3) Section Ð ....................... 45 7-10. Schematic Diagram Ð Video (3/3) Section Ð .................... 47 7-11. Printed Wiring Board Ð Main Section Ð ........................... 49 7-12. Schematic Diagram Ð Main (1/4) Section Ð ..................... 51 7-13. Schematic Diagram Ð Main (2/4) Section Ð ..................... 53 7-14. Schematic Diagram Ð Main (3/4) Section Ð ..................... 55 7-15. Schematic Diagram Ð Main (4/4) Section Ð ..................... 57 7-16. Printed Wiring Board Ð Leaf SW Section Ð ..................... 59 7-17. Schematic Diagram Ð Leaf SW Section Ð ........................ 59 7-18. Printed Wiring Board Ð Panel Section Ð ........................... 61 7-19. Schematic Diagram Ð Panel (1/2) Section Ð ..................... 63 7-20. Schematic Diagram Ð Panel (2/2) Section Ð ..................... 65 7-21. Schematic Diagram Ð Surround Section Ð ....................... 67 7-22. Printed Wiring Board Ð Surround Section Ð ..................... 68 7-23. Schematic Diagram Ð Front Amp Section Ð ..................... 69 7-24. Printed Wiring Board Ð Front Amp Section Ð .................. 71 7-25. Schematic Diagram Ð CD Motor Section Ð ...................... 73 7-26. Printed Wiring Board Ð CD Motor Section Ð ................... 75 7-27. Schematic Diagram Ð Trans Section Ð ............................. 77 7-28. Printed Wiring Board Ð Trans Section Ð ........................... 78 7-29. IC Block Diagrams ........................................................... 79 7-30. IC Pin Functions ............................................................... 82 8. EXPLODED VIEWS 8-1. Case Section ........................................................................ 92 8-2. Chassis Section ................................................................... 93 8-3. Front Panel Section ............................................................. 94 8-4. CD Mechanism Deck Section-1 (CDM38L-5BD34L) ....... 95 8-5. CD Mechanism Deck Section-2 (CDM38L-5BD34L) ....... 96 8-6. Base Unit Section (BU-5BD34L) ....................................... 97 8-7. TC Mechanism Section-1 (TCM230AWR2/230PWR2) .... 98 8-8. TC Mechanism Section-2 (TCM230AWR2/230PWR2) .... 99 9. ELECTRICAL PARTS LIST.............................. 100 NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, ob- serve from more than 30 cm away from the objective lens. LASER DIODE AND FOCUS SEARCH OPERATION CHECK Carry out the ÒS curve checkÓ in ÒCD section adjustmentÓ and check that the S curve waveform is output four times.