Sony hcd vx 55 hcd vx 55j
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2 Tuner section FM stereo, FM/AM superheterodyne tuner FM tuner section Tuning rangeTourist model : 76 - 108 MHz Other models : 87.5 – 108.0 MHz Antenna FM lead antenna Antenna terminals 75 ohm unbalanced Intermediate frequency AM tuner section Tuning range Middle Eastern models: 531 – 1,602 kHz (with the interval set at 9 kHz) Other models: 531 – 1,602 kHz (with the interval set at 9 kHz) 530 – 1,710 kHz (with the interval set at 10 kHz) Antenna AM loop antenna Antenna terminals External antenna terminal Intermediate frequency 450 kHz General Power requirements Thailand models: 220 V AC, 50/60 Hz Other models: 120 V, 220 V or 230 - 240 V AC, 50/60 Hz Adjustable with voltage selector Power consumption230 watts Dimensions (w/h/d)Approx. 280 x 360 x 425 mm (11 x 14 3/16 x 16 11/16 in.) Mass:Approx. 9.5 kg (21 lb.) Supplied accessories: AM loop antenna (1) Remote commander (1) Batteries (2) Video cable (1) FM lead antenna (1) Front speaker pads (8) Design and specifications are subject to change without notice.10.7 MHz SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. 1. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard wiring to ensure that no wires are "pinched" or contact high-wattage resistors. 3. Look for unauthorized replacement parts, particularly transistors, that were installed during a previous repair. Point them out to the customer and recommend their replacement. 4. Look for parts which, through functioning, show obvious signs of deterioration. Point them out to the customer and recommend their replacement. SAFETY CHECK-OUT After correcting the original service problem, perform the following safety checks before releasing the set to the customer. 5. Check the B+ voltage to see it is at the values specified. 6. Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270˚C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering.
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3 This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Notes on chip component replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing -Keep the temperature of soldering iron around 270˚C during repairing. -Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). -Be careful not to apply force on the conductor when soldering or unsoldering. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. TABLE OF CONTENTS 1. SERVICE NOTE ·······························································4 2. GENERAL ··········································································5 3. DISASSEMBY ··································································7 4. TEST MODE ····································································12 5. MECHANICAL ADJUSTMENTS ·····························16 6. ELECTRICAL ADJUSTMENTS ·······························16 7. DIAGRAMS 7-1. Circuit Board Location·················································23 7-2. Block Diagrams····························································25 7-3. Printed Wiring Board BD Section·····························28 7-4. Schematic Diagram BD Section································29 7-5. Printed Wiring Board Main Section··························30 7-6. Schematic Diagram Main Section (1/3)····················31 7-7. Schematic Diagram Main Section (2/3)····················32 7-8. Schematic Diagram Main Section (3/3)····················33 7-9. Printed Wiring Board Power AMP Section···············34 7-10. Schematic Diagram Power AMP Section················35 7-11. Printed Wiring Board Panel Section························36 7-12. Schematic Diagram Panel Section···························37 7-13. Printed Wiring Board Leaf SW Section···················38 7-14. Schematic Diagram Leaf SW Section·····················39 7-15. Printed Wiring Board Driver Section·······················40 7-16. Schematic Diagram Driver Section·························41 7-17. Printed Wiring Board Video CD Section·················42 7-18. Schematic Diagram Video CD Section (1/2)···········43 7-19. Schematic Diagram Video CD Section (2/2)···········44 7-20. Printed Wiring Board Power Section·······················45 7-21. Schematic Diagram Power Section··························45 7-22. IC Pin Function Description·······································46 7-23. IC Block Diagrams·····················································50 8. EXPLODED VIEWS 8-1. Main Section·································································54 8-2. Panel Section································································55 8-3. Main Board Section······················································56 8-4. Tape Mechanism Section (TCM-230PWR11) (1/2)·····57 8-5. Tape Mechanism Section (TCM-230PWR11) (2/2)·····58 8-6. CD Mechanism Section (CDM58-K2BD37)···············59 9. ELECTRICAL PARTS LIST ·······································60