Sony hcd v 8800 service manual

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Ñ 3 ÑTABLE OF CONTENTS 1. SERVICING NOTE .......................................................... 4 2. GENERAL .......................................................................... 6 3. DISASSEMBLY 3-1. Front Panel ........................................................................... 7 3-2. Main Board ........................................................................... 8 3-3. Tape Mechanism Deck .......................................................... 8 3-4. Cassette Lid Assembly .......................................................... 9 3-5. CD Lid Assembly .................................................................. 9 3-6. CD Mechanism Deck .......................................................... 10 3-7. Base Unit ........................................................................... 10 3-8. Disc Table ........................................................................... 10 4. TEST MODE.............................................................. 11 5. MECHANICAL ADJUSTMENTS........................... 12 6. ELECTRICAL ADJUSTMENTS ............................... 12 7. DIAGRAMS 7-1. Circuit Boards Location ...................................................... 17 7-2. Block Diagrams ¥ KEY CON Section ........................................................... 18 ¥ CD Section ....................................................................... 19 ¥ Video Section ................................................................... 21 ¥ Deck Section .................................................................... 23 ¥ Main Section .................................................................... 25 ¥ Power Section .................................................................. 27 7-3. Printed Wiring Board Ñ CD Section Ñ ............................. 29 7-4. Schematic Diagram Ñ CD Section Ñ ............................... 31 7-5. Schematic Diagram Ñ Video Section Ñ ........................... 33 7-6. Printed Wiring Board Ñ Video Section Ñ ......................... 37 7-7. Printed Wiring Board Ñ Main Section Ñ .......................... 40 7-8. Schematic Diagram Ñ Main Section Ñ ............................ 43 7-9. Schematic Diagram Ñ Deck Section Ñ ............................ 47 7-10. Printed Wiring Board Ñ Deck Section Ñ ....................... 51 7-11. Schematic Diagram Ñ Panel Section Ñ ......................... 54 7-12. Printed Wiring Board Ñ Panel Section Ñ ....................... 57 7-13. Schematic Diagram Ñ Power Section Ñ ........................ 61 7-14. Printed Wiring Board Ñ Power Section Ñ ..................... 65 7-15. Schematic Diagram Ñ CD Motor Section Ñ .................. 68 7-16. Printed Wiring Board Ñ CD Motor Section Ñ ............... 69 7-17. Schematic Diagram Ñ KEY CON Section Ñ ................. 71 7-18. Printed Wiring Board Ñ KEY CON Section Ñ .............. 72 7-19. IC Block Diagrams ........................................................... 73 7-20. IC Pin Functions ............................................................... 80 8. EXPLODED VIEWS 8-1. Case and Back Panel Section .............................................. 97 8-2. Front Panel Section 1 .......................................................... 98 8-3. Front Panel Section 2 .......................................................... 99 8-4. Chassis Section ................................................................. 100 8-5. TC Mechanism Section-1 (TCM-220WR2) ..................... 101 8-6. TC Mechanism Section-2 (TCM-220WR2) ..................... 102 8-7. TC Mechanism Section-3 (TCM-220WR2) ..................... 103 8-8. CD Mechanism Section (CDM37L-5BD21AL) ............... 104 8-9. Base Unit Section (BU-5BD21AL) .................................. 105 9. ELECTRICAL PARTS LIST ...................................... 106 NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repain parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, ob- serve from more than 30 cm away from the objective lens. LASER DIODE AND FOCUS SEARCH OPERATION CHECK Carry out the ÒS curve checkÓ in ÒCD section adjustmentÓ and check that the S curve waveform is output three times.