Sony hcd v 4800 service manual
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Extracted text from sony hcd v 4800 service manual (Ocr-read)
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Ð 2 Ð SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. The following caution label is located inside the unit. MODEL IDENTIFICATION Ð BACK PANEL Ð MODEL PART NO. Singapore4-992-219-0p Malaysia, Thai4-992-219-1p Chinese4-992-219-2p Indonesia4-992-219-3p PART No.
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Ð 3 Ð TABLE OF CONTENTS 1. GENERAL ............................................................ 4 2. DISASSEMBLY ................................................... 7 3. TEST MODE ....................................................... 15 4. MECHANICAL ADJUSTMENTS .................... 18 5. ELECTRICAL ADJUSTMENTS DECK Section........................................................... 18 CD Section............................................................... 21 VIDEO Section......................................................... 22 6. DIAGRAMS 6-1. IC Pin Function Description....................................... 23 6-2. Printed Wiring Boar d ÑBD SectionÑ........................ 33 6-3.Schematic Diagram ÑBD SectionÑ........................... 35 6-4. Printed Wiring Boar ds ÑCD MO TOR SectionÑ......... 37 6-5. Sc hematic Dia gram ÑCD MO TOR SectionÑ............. 39 6-6. Printed Wiring Boar ds ÑVIDEO SectionÑ................. 42 6-7.Schematic Diagram ÑVIDEO SectionÑ..................... 45 6-8.Schematic Diagram ÑDECK SectionÑ...................... 51 6-9. Printed Wiring Boar ds ÑDECK SectionÑ.................. 55 6-10.Printed Wiring Boar ds ÑMAIN/DECK/PO WER SUPPL Y SectionÑ............. 58 6-11.Schematic Diagram ÑMAIN/POWER SUPPL Y SectionÑ........................ 61 6-12. Schematic Dia gram ÑP ANEL SectionÑ..................... 68 6-13. Printed Wiring Boar ds ÑP ANEL SectionÑ................. 71 6-14.Schematic Diagram ÑPO WER AMP/KEY CONTR OL SectionÑ.............. 74 6-15.Printed Wiring Boar ds ÑPO WER AMP/KEY CONTR OL SectionÑ.............. 77 7. EXPLODED VIEWS .......................................... 88 8. ELECTRICAL PARTS LIST ............................. 97 SERVICING NOTES The laser diode in the optical pick-up block may suffer electro- static break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emis- sion, observe from more than 30 cm away from the objective lens. LASER DIODE AND FOCUS SEARCH OPERATION CHECK Carry out the ÒS curve checkÓ in ÒCD section adjustmentÓ and check that the S curve waveforms is output three times. Notes on chip component replacement ¥ Ne ver reuse a disconnected c hip component. ¥ Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing ¥ Keep the temperature of the soldering ir on ar ound 270 ûC during repairing. ¥ Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). ¥ Be careful not to apply force on the conductor when soldering or unsoldering. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT