Sony hcd tb 10 service manual
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2 HCD-TB10 TABLE OF CONTENTS 1. SERVICING NOTES ······················································· 3 2. GENERAL ·········································································· 5 3. DISASSEMBLY ································································ 7 3-1. Side Panel ····································································· 8 3-2. Top Panel ······································································ 8 3-3. Cassette Mechanism (CMAL1Z222A) ························ 9 3-4. Front Panel ··································································· 9 3-5. H/P Board, PANEL Board ········································· 10 3-6. LCD Board, BACK LIGHT Board ···························· 10 3-7. VOL Board ································································· 11 3-8. SUB TRANSFORMER Board, Back Panel ··············· 11 3-9. MAIN Board ······························································ 12 3-10. CDM Board, CD Mechanism Deck (CDM55C-K6A) ························································ 12 3-11. Power Trans Former, P-AMP Board ·························· 13 3-12. Cam (CDM55) ··························································· 13 3-13. MOTOR (TRAY) Board ············································ 14 3-14. Holder Assy ································································ 14 3-15. MOTOR Board ··························································· 15 4. TEST MODE ···································································· 16 5. ELECTRICAL ADJUSTMENTS ······························· 17 6. DIAGRAMS ······································································ 19 6-1. Circuit Boards Location ············································· 19 6-2. Block Diagrams ·························································· 21 6-3. Printed Wiring Board – MAIN Section – ·················· 23 6-4. Schematic Diagram – MAIN Section (1/4) – ············ 24 6-5. Schematic Diagram – MAIN Section (2/4) – ············ 25 6-6. Schematic Diagram – MAIN Section (3/4) – ············ 26 6-7. Schematic Diagram – MAIN Section (4/4) – ············ 27 6-8. Schematic Diagram – PANEL Section – ··················· 28 6-9. Printed Wiring Board – PANEL Section – ················ 29 6-10. Printed Wiring Board – LCD Section – ··················· 30 6-11. Schematic Diagram – AMP/POWER Section – ········ 31 6-12. Printed Wiring Board – AMP Section – ···················· 32 6-13. Printed Wiring Board – POWER Section – ·············· 33 6-14. Schematic Diagram – CD Section – ························· 34 6-15. Printed Wiring Board – CD Section – ······················· 35 6-16. Printed Wiring Board – MOTOR Section – ·············· 36 6-17. IC Pin Function Description ······································ 39 7. EXPLODED VIEWS ······················································ 41 7-1. Side Panel, Back Panel Section ·································· 41 7-2. Front Panel Section ···················································· 42 7-3. Chassis Section ·························································· 43 7-4. CD Mechanism Deck Section (CDM55C-K6A) ······· 44 8. ELECTRICAL PARTS LIST ······································· 45
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3 HCD-TB10 SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Notes on chip component replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing -Keep the temperature of soldering iron around 270˚C during repairing. -Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). -Be careful not to apply force on the conductor when soldering or unsoldering. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. SECTION 1 SERVICING NOTES This caution label is located inside the unit.