Sony hcd sd 1 service manual
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Extracted text from sony hcd sd 1 service manual (Ocr-read)
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Ð 2 Ð CAUTIONUse of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. Notes on chip component replacement ¥ Never reuse a disconnected chip component. ¥ Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing ¥ Keep the temperature of soldering iron around 270ûC during repairing. ¥ Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). ¥ Be careful not to apply force on the conductor when soldering or unsoldering. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PROD- UCT MARKING is located on the rear exterior. This caution label is located inside the unit. SAFETY-RELATED COMPONENT WARNING !! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. PARTS No. 4-212-711-0¹ 4-212-712-0¹ MODEL AEP, UK model SP, HK model ¥ Abbreviation HK : Hong Kong model SP : Singapore model Parts No. MODEL NO. HCD-SD1 MODEL IDENTIFICATION Ð Specification Label Ð
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Ð 3 Ð TABLE OF CONTENTS 1. SERVICING NOTE .......................................................... 4 2. GENERAL .......................................................................... 7 3. DISASSEMBLY 3-1. Loading Panel ....................................................................... 8 3-2. Glass ASSY ........................................................................... 8 3-3. Front Panel ........................................................................... 9 3-4. Main Board and Tuner Unit .................................................. 9 3-5. CD Mechanism Deck .......................................................... 10 3-6. Back Panel ......................................................................... 10 3-7. Disc Table .......................................................................... 11 3-8. Optical Pick-up ................................................................... 11 4. SERVICE MODE ............................................................. 12 5. TEST MODE ..................................................................... 13 6. ELECTRICAL ADJUSTMENTS ............................... 14 7. DIAGRAMS 7-1. Circuit Boards Location ...................................................... 16 7-2. Block Diagrams ¥ BD Section ....................................................................... 17 ¥ Main Section .................................................................... 19 7-3. Schematic Diagram Ð BD Section Ð ................................... 23 7-4. Printed Wiring Board Ð BD Section Ð ................................. 25 7-5. Schematic Diagram Ð Main (1/2) Section Ð ........................ 27 7-6. Schematic Diagram Ð Main (2/2) Section Ð ........................ 29 7-7. Printed Wiring Board Ð Main Section Ð .............................. 31 7-8. Schematic Diagram Ð Sub Trans Section Ð ......................... 33 7-9. Printed Wiring Board Ð Sub Trans Section Ð ...................... 34 7-10. Schematic Diagram Ð Panel Section Ð ............................. 35 7-11. Printed Wiring Board Ð Panel Section Ð ........................... 37 7-12. Schematic Diagram Ð AMP Section Ð .............................. 39 7-13. Printed Wiring Board Ð AMP Section Ð ........................... 41 7-14. Schematic Diagram Ð Connector Section Ð ...................... 43 7-15. Printed Wiring Board Ð Connector Section Ð ................... 45 7-16. Schematic Diagram Ð REG Section Ð .............................. 47 7-17. Printed Wiring Board Ð REG Section Ð ............................ 49 7-18. IC Block Diagrams ........................................................... 51 7-19. IC Pin Functions ............................................................... 54 8. EXPLODED VIEWS 8-1. Front Panel Section ............................................................. 56 8-2. Chassis Section ................................................................... 57 8-3. Mechanism Deck Section (CDM13B-5BD19) ................... 58 8-4. Base Unit Section (BU-5BD19) .......................................... 59 9. ELECTRICAL PARTS LIST ........................................ 60 NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, ob- serve from more than 30 cm away from the objective lens. LASER DIODE AND FOCUS SEARCH OPERATION CHECK Carry out the ÒS curve checkÓ in ÒCD section adjustmentÓ and check that the S curve waveform is output two times.