Sony hcd s 300 service manual
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Extracted text from sony hcd s 300 service manual (Ocr-read)
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2 SAFETY CHECK-OUT After correcting the original service problem, perform the follow- ing safety checks before releasing the set to the customer: Check the antenna terminals, metal trim, metallized knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below. LEAKAGE The AC leakage from any exposed metal part to earth Ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microampers). Leak- age current can be measured by any one of three methods. 1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers instructions to use these instruments. 2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job. 3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The limit indication is 0.75 V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a pas- sive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2V AC range are suitable. (See Fig. A) Fig. A. Using an AC voltmeter to check AC leakage. 0.15µFTo Exposed Metal Parts on Set 1.5kΩAC voltmeter (0.75V) Earth Ground SAFETY-RELATED COMPONENT WARNING !! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. CAUTIONUse of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing - Keep the temperature of soldering iron around 270˚C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PROD- UCT MARKING is located on the rear exterior. This caution label is located inside the unit.
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3 NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, ob- serve from more than 30 cm away from the objective lens. LASER DIODE AND FOCUS SEARCH OPERATION CHECK Carry out the S curve check in CD section adjustment and check that the S curve waveform is output several times. 1. SERVICING NOTE .......................................................... 4 2. GENERAL .......................................................................... 5 3. DISASSEMBLY 3-1. Loading Panel ...................................................................... 6 3-2. Front Panel ........................................................................... 6 3-3. CD Mechanism .................................................................... 7 3-4. Disc Tray .............................................................................. 7 4. TEST MODE ....................................................................... 8 5. ELECTRICAL ADJUSTMENT ................................. 18 6. DIAGRAMS 6-1. Circuit Boards Location ..................................................... 19 6-2. Block Diagrams ................................................................. 21 -RF/Servo Section ............................................................ 21 -Main Section ................................................................... 22 -Signal Process/Video Section ......................................... 23 -Audio Main Section ........................................................ 24 -I/O, Tuner Section .......................................................... 25 -AMP Section ................................................................... 26 -Display Section ............................................................... 26 -Power Section ................................................................. 27 6-3. Printed Wiring Board – TK Section –................................ 28 6-4. Schematic Diagram – TK Section –.................................. 29 6-5. Printed Wiring Board – DVD Section –............................ 30 6-6. Schematic Diagram – DVD (1/12) Section –.................... 32 6-7. Schematic Diagram – DVD (2/12) Section –.................... 33 6-8. Schematic Diagram – DVD (3/12) Section –.................... 34 6-9. Schematic Diagram – DVD (4/12) Section –.................... 35 6-10. Schematic Diagram – DVD (5/12) Section –.................... 36 6-11. Schematic Diagram – DVD (6/12) Section –.................... 37 6-12. Schematic Diagram – DVD (7/12) Section –.................... 38 6-13. Schematic Diagram – DVD (8/12) Section –.................... 39 6-14. Schematic Diagram – DVD (9/12) Section –.................... 40 6-15. Schematic Diagram – DVD (10/12) Section –.................. 41 6-16. Schematic Diagram – DVD (11/12) Section –.................. 42 6-17. Schematic Diagram – DVD (12/12) Section –.................. 43 6-18. Schematic Diagram – FRONT (1/2) Section –................. 44 6-19. Printed Wiring Board – FRONT (1/2) Section –.............. 45 6-20. Schematic Diagram – FRONT (2/2) Section –................. 46 6-21. Printed Wiring Board – FRONT (2/2) Section –.............. 47 6-22. Schematic Diagram – VIDEO Section –........................... 48 6-23. Printed Wiring Board – VIDEO Section –......................... 49 6-24. Schematic Diagram – AUDIO Section –........................... 50 6-25. Printed Wiring Board – AUDIO Section –........................ 51 6-26. Schematic Diagram – PROTECT Section –...................... 52 6-27. Printed Wiring Board – PROTECT Section –................... 53 6-28. Printed Wiring Board – POWER (US only) Section –...... 54 6-29. Printed Wiring Board – POWER (AEP, UK, SP, HK, E32, AUS only) Section –.. 56 6-30. Schematic Diagram – POWER (1/4) Section –................. 58 6-31. Schematic Diagram – POWER (2/4) Section –................. 59 6-32. Schematic Diagram – POWER (3/4) Section –................. 60 6-33. Schematic Diagram – POWER (4/4) Section –................. 61 6-34. Schematic Diagram – LOADING Section –..................... 62 6-35. Printed Wiring Board – LOADING Section –................... 62 6-36. IC Block Diagrams ............................................................ 63 6-37. IC Pin Functions ................................................................ 67 TABLE OF CONTENTS 7. EXPLODED VIEWS 7-1. Case and Chassis Section ................................................... 71 7-2. Front Panel Section ............................................................ 72 7-3. Mechanism Section ............................................................ 73 8. ELECTRICAL PARTS LIST................................. 74