Sony hcd rx 66 service manual

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Ð 3 Ð TABLE OF CONTENTS 1. SERVICING NOTES ............................................... 3 2. GENERAL Location of Controls ....................................................... 6 Setting the Time .............................................................. 7 3. DISASSEMBLY ......................................................... 8 4. TEST MODE .............................................................. 11 5. MECHANICAL ADJUSTMENTS ....................... 13 6. ELECTRICAL ADJUSTMENTS DECK Section ................................................................. 13 CD Section ...................................................................... 16 7. DIAGRAMS ................................................................. 18 7-1. Block Diagram Ð CD MECHANISM DECK Section Ð .......................... 19 7-2. Block Diagram Ð TAPE DECK Section Ð ................................................ 21 7-3. Block Diagram Ð MAIN Section Ð ........................................................... 23 7-4. Block Diagram Ð DISPLAY/KEY CONTROL/POWER SUPPLY Section Ð ........................................................................ 25 7-5. Printed Wiring Boards Ð CD Section Ð ......................... 29 7-6. Schematic Diagram Ð CD Section Ð ............................... 31 7-7. Printed Wiring Board Ð CD MOTOR Section Ð ............ 33 7-8. Schematic Diagram Ð CD MOTOR Section Ð .............. 35 7-9. Printed Wiring Board Ð TAPE DECK Section Ð ........... 37 7-10. Schematic Diagram Ð TAPE DECK Section Ð .............. 39 7-11. Printed Wiring Board Ð LEAF SW Section Ð ............... 41 7-12. Schematic Diagram Ð LEAF SW Section Ð .................. 41 7-13. Printed Wiring Board Ð MAIN Section Ð ...................... 43 7-14. Schematic Diagram Ð MAIN Section (1/4) Ð .................................................. 45 7-15. Schematic Diagram Ð MAIN Section (2/4) Ð .................................................. 47 7-16. Schematic Diagram Ð MAIN Section (3/4) Ð .................................................. 49 7-17. Schematic Diagram Ð MAIN Section (4/4) Ð .................................................. 51 7-18. Printed Wiring Board Ð PANEL Section Ð .................... 53 7-19. Schematic Diagram Ð PANEL Section Ð ....................... 55 7-20. Printed Wiring Board Ð CD-SW Section Ð .................... 57 7-21. Schematic Diagram Ð CD-SW Section Ð ...................... 57 7-22. Printed Wiring Board Ð HP Section Ð ........................... 59 7-23. Schematic Diagram Ð HP Section Ð .............................. 59 7-24. Printed Wiring Board Ð POWER AMP Section Ð ......... 60 7-25. Schematic Diagram Ð POWER AMP Section Ð ............ 61 7-26. Printed Wiring Board Ð TRANSFORMER Section Ð ........................................ 63 7-27. Schematic Diagram Ð TRANSFORMER Section Ð ........................................ 64 7-28. IC Pin Function Description ........................................... 68 8. EXPLODED VIEWS ................................................ 73 9. ELECTRICAL PARTS LIST ............................... 82 SECTION 1 SERVICING NOTES The laser diode in the optical pick-up block may suffer electro- static break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emis- sion, observe from more than 30 cm away from the objective lens. Notes on chip component replacement ¥ Never reuse a disconnected chip component. ¥ Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing ¥ Keep the temperature of the soldering iron around 270 ûC dur- ing repairing. ¥ Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). ¥ Be careful not to apply force on the conductor when soldering or unsoldering. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. The following caution label is located inside the unit. CAUTION : INVISIBLE LASER RADIATION WHEN OPEN AND INTER- LOCKS DEFEATED. AVOID EXPOSURE TO BEAM. ADVARSEL : USYNLIG LASERSTRLING VED BNING NR SIKKERHEDSAFBRYDERE ER UDE AF FUNKTION. UNDG UDSAETTELSE FOR STRLING. VORSICHT : UNSICHTBARE LASERSTRAHLUNG, WENN ABDECKUNG GE…FFNET UND SICHEREITSVERRIEGELUNG †BERBR†CKT. NICHT DEM STRAHL AUSSETZEN. VA RO ! :AVATTAESSA JA SUOJALUKITUS OHITETTAESSA OLET ALTTIINA N€KYM€TT…M€LLE LASERS€TEILYLLE. €L€ KATSO S€TEESEEN. VARNING : OSYNLING LASERSTRLING N€R DENNA DEL €R …PPNAD OCH SP€RREN €R URKOPPLAD. BETRAKTA EJ STRLEN. ADVERSEL : USYNLIG LASERSTRLING NR DEKSEL PNES OG SIKKERHEDSLS BRYTES. UNNG EKSPONERING FOR STRLEN. VIGYAZAT !:A BURKOLAT NYITçSAKOR LçTHATATLAN LƒZERSUGçRVESZƒLY! KER†LJE A BESUGçRZçST !