Sony hcd rg 66 t service manual
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Extracted text from sony hcd rg 66 t service manual (Ocr-read)
Page 1
HCD-RG66T 2 General Power requirements Mexican model: 120 V AC, 60 Hz Argentina model:220 V AC, 50/60 Hz Other models: 120 V, 220 V or 230 - 240 V AC, 50/60 Hz Adjustable with voltage selector Power consumption 230 watts Dimensions (w/h/d) Approx. 280 x 360 x 445 mm Mass : Approx. 11.0 kg Design and specifications are subject to change without notice. Notes on chip component replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing -Keep the temperature of the soldering iron around 270 ˚C dur- ing repairing. -Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). -Be careful not to apply force on the conductor when soldering or unsoldering. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY. The following caution label is located inside the unit. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior.
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HCD-RG66T 3 TABLE OF CONTENTS 1. SERVICING NOTES ................................................ 4 2. GENERAL Location of Controls ....................................................... 5 Setting the Clock ............................................................. 6 3. DISASSEMBLY 3-1. Disassembly Flow ........................................................... 7 3-2. Top Case .......................................................................... 8 3-3. Loading Panel .................................................................. 8 3-4. CD Mechanism Deck (CDM58E-30BD60C) ................. 9 3-5. Front Panel Section ......................................................... 9 3-6. Back Panel Section .......................................................... 10 3-7. MAIN Board ................................................................... 10 3-8. Base Unit (BU-30BD60C) .............................................. 11 3-9. DRIVER Board, MOTOR Board and SENSOR (CD) Board .............................................. 11 3-10. Tape Mechanism Deck (TCM-230AWR41CS) .............. 12 3-11. Belt .................................................................................. 12 3-12. SW Board, HEAD (A) Board and HEAD (B) Board ...................................................... 13 4. TEST MODE .............................................................. 14 5. MECHANICAL ADJUSTMENTS ....................... 18 6. ELECTRICAL ADJUSTMENTS Deck section .................................................................... 18 CD Section ...................................................................... 21 7. DIAGRAMS 7-1. Block Diagram – CD SERVO Section – ....................... 23 7-2. Block Diagram – TUNER/TAPE DECK Section – ...... 24 7-3. Block Diagram – MAIN Section – ................................ 25 7-4. Block Diagram – DISPLAY/KEY CONTROL/ POWER SUPPLY Section – ........................................... 26 7-5. Note for Printed Wiring Boards and Schematic Diagrams ....................................................... 27 7-6. Printed Wiring Board – BD Board – ............................. 28 7-7. Schematic Diagram – BD Board – ................................ 29 7-8. Printed Wiring Boards – DRIVER/MOTOR/SENSOR (CD) Boards – .............. 30 7-9. Schematic Diagram – DRIVER/MOTOR/SENSOR (CD) Boards – .............. 30 7-10. Printed Wiring Boards – SW/HEAD (A)/HEAD (B) Boards – .......................... 31 7-11. Schematic Diagram – SW Board – ................................ 32 7-12. Printed Wiring Boards – MAIN Board – ....................... 33 7-13. Schematic Diagram – MAIN Board (1/4) – .................. 34 7-14. Schematic Diagram – MAIN Board (2/4) – .................. 35 7-15. Schematic Diagram – MAIN (3/4)/HEAD (A)/HEAD (B) Boards – ............. 36 7-16. Schematic Diagram – MAIN Board (4/4) – .................. 37 7-17. Printed Wiring Board – GAME IN Board – .................. 38 7-18. Schematic Diagram – GAME IN Board – ..................... 39 7-19. Printed Wiring Boards – POWER/SENSOR Boards – ........................................ 40 7-20. Schematic Diagram – POWER/SENSOR Boards – ........................................ 41 7-21. Printed Wiring Boards – PANEL/CD OPEN/CD SWITCH Boards – ................ 42 7-22. Schematic Diagram – PANEL/CD OPEN/CD SWITCH Boards – ................ 437-23. Printed Wiring Boards – PAD SWITCH/VOL Boards – ..................................... 44 7-24. Schematic Diagram – PAD SWITCH/VOL Boards – ..................................... 45 7-25. Printed Wiring Boards – MAIN TRANS/SUB-TRANS Boards – ...................... 46 7-26. Schematic Diagram – MAIN TRANS/SUB-TRANS Boards – ...................... 47 7-27. IC Pin Function Description ........................................... 49 8. EXPLODED VIEWS 8-1. Panel Section ................................................................... 53 8-2. Front Panel Section ......................................................... 54 8-3. Chassis Section ............................................................... 55 8-4. CD Mechanism Deck Section (CDM58E-30BD60C) ..................................................... 56 8-5. Base Unit Section (BU-30BD60C) ................................. 57 8-6. Tape Mechanism Deck Section (TCM-230AWR41CS) .................................................... 58 9. ELECTRICAL PARTS LIST ............................... 59